LT1490A/LT1491A
13
14901afd
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 t0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 t 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 t 0.10
(2 SIDES)
0.75 t0.05
R = 0.125
TYP
2.38 t0.10
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 t 0.05
2.38 t0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 t0.05
(2 SIDES)2.10 t0.05
0.50
BSC
0.70 t0.05
3.5 t0.05
PACKAGE
OUTLINE
0.25 t 0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm w 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
MSOP (MS8) 0307 REV F
0.53 t 0.152
(.021 t .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 t 0.0508
(.004 t .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0s
– 6
s
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
t 0.152
(.193 t .006)
8
7
6
5
3.00 t 0.102
(.118 t .004)
(NOTE 3)
3.00 t 0.102
(.118 t .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
t
0.127
(.035
t
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
t
0.038
(.0165
t
.0015)
TYP
0.65
(.0256)
BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
LT1490A/LT1491A
14
14901afd
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
N8 REV I 0711
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 t .005
(3.302 t 0.127)
.020
(0.508)
MIN
.018 t .003
(0.457 t 0.076)
.120
(3.048)
MIN
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255

12
3
4
87 6
5
.255 t .015*
(6.477 t 0.381)
.400*
(10.160)
MAX
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
N Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
s
45
o
0
o
– 8
o
TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
p.005
RECOMMENDED SOLDER PAD LAYOUT
.045 p.005
.050 BSC
.030 p.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
LT1490A/LT1491A
15
14901afd
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
N14 REV I 0711
.020
(0.508)
MIN
.120
(3.048)
MIN
.130 ± .005
(3.302 ± 0.127)
.045 – .065
(1.143 – 1.651)
.065
(1.651)
TYP
.018 ± .003
(0.457 ± 0.076)
.005
(0.127)
MIN
.255 ± .015*
(6.477 ± 0.381)
.770*
(19.558)
MAX
31
2
4
5
6
7
8910
11
1213
14
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
0.381
8.255

NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
1
N
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
14
13
.337 – .344
(8.560 – 8.738)
NOTE 3
.228 – .244
(5.791 – 6.197)
12
11 10
9
5
6
7
N/2
8
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
w 45
0° – 8° TYP
.008 – .010
(0.203 – 0.254)
S14 0502
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
.245
MIN
N
123 N/2
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
N Package
14-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
S Package
14-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)

LT1491AIS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Operational Amplifiers - Op Amps Quad uP R-to-R I/O Op Amp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union