LQW04CAR29K00D

SpecNo.JELF243A-0150-01 P.4/8
MURATA MFG.CO.,LTD
Reference Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.1N to 0.6N
(minimum value is typical)
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number( 1) ,RoHS Marking( 2),
Quantity etc ・・・
1) < Expression of Inspection No.>
□□ OOOO ×××
(1) (2) (3)
(1) Factory code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) < Expression of RoHS Marking > ROHS Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking ( 2) ,Quantity, etc ・・・
F
Cover tape
Base tape
165
°
to 180
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
SpecNo.JELF243A-0150-01 P.5/8
MURATA MFG.CO.,LTD
Reference Only
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 80μm to 100μm.
Please pay attention to solder paste's penetrating in order to avoid short circuit between the lines.
a 0.45
b 1.05
c 0.48
W
D
Label
H
a
b
c
Chip Coil
Solder resist
Land
SpecNo.JELF243A-0150-01 P.6/8
MURATA MFG.CO.,LTD
Reference Only
11.3 Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating
150°C180°C 90s±30s
Heating
above 220°C30s60s above 230°C60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
11.4 Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3TtT
Tthickness of electrode
11.5 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Poor example
Good example
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
<
b
Recommendable(t)
Upper Limit
T
Recommendable(t)
Upper Limit
T

LQW04CAR29K00D

Mfr. #:
Manufacturer:
Description:
FIXED IND 290NH 270MA 940 MOHM
Lifecycle:
New from this manufacturer.
Delivery:
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