BLM41PG102SN1L

Spec. No. JENF243A-0007T-01 P.4/8
MURATA MFG.CO., LTD.
Reference Only
8-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 2500 pcs. / reel
(2) There shall be leader-tape(cover tape only and empty tape ) and trailer- tape(empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. » □□
OOOO ×××
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc)
(5) Dimensions of reel and taping(leader-tape, trailer-tape)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 3
Above Outer Case size is typical. It depends on a quantity of an
order.
9. Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
13.0
17.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
+1
-0
Cover tape
(in mm)
Label
W
D
Label
H
Spec. No. JENF243A-0007T-01 P.5/8
MURATA MFG.CO., LTD.
Reference Only
d
e
a
b
c
a
b
d
e
c
e
e
2.5mm pitch
Chip Ferrite Bead
Solder Resist
Pattern
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (vehicles,trains,ships,etc.)
(4)Power plant control equipment (9)Applications of similar complexity and /or reliability requirements
(5)Medical equipment to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
Rated
Current
(A)
Land pad thickness and
dimension a
18µm 35µm 70µm
1.5/2 1.2 1.2 1.2
3.5 2.4 1.2 1.2
6 6.4 3.3 1.65
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Land dimensions on Flow soldering for 2.5mm pitch mounting
*Taking land pad thickness and rated current
into account.
a b c d e
3.0 5.5 to 6.5 1.2 1.8 1.5
(in mm)
*The pattern shall be designed to above drawing to
prevent causing the solder bridge when products
are mounted by 2.5mm pitch flow soldering.
3.0
5.5to6.5
Chip Ferrite Bead
Solder Resist
Pattern
a
1.2
Spec. No. JENF243A-0007T-01 P.6/8
MURATA MFG.CO., LTD.
Reference Only
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(3)
soldering profile
Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、46s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
265℃±3

BLM41PG102SN1L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Ferrite Beads 1806 1K OHM
Lifecycle:
New from this manufacturer.
Delivery:
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