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AT25HP256-10PI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
19
AT25HP256/512
1113I–SEEPR–6/03
8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
5/2/02
8S2
B
Top View
Side View
End View
H
1
N
C
E
A
b
L
A1
e
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs aren't included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b,C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/-0.005 mm.
A 1.78 2.03
A1 0.05 0.33
b 0.35 0.51 5
C 0.18 0.25 5
D 5.13 5.38
E 5.13 5.41 2, 3
H 7.62 8.38
L 0.51 0.89
e 1.27 BSC 4
20
AT25HP256/512
1113I–SEEPR–6/03
16S2 – JEDEC SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
16S2, 16-lead, 0.300" Wide Body, Plastic Gull
Wing Small Outline Package (SOIC)
1/9/02
16S2
A
L
A1
Side View
Top View
End View
H
E
b
N
1
e
A
D
C
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-013, Variation AA for additional information.
2. Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006") per side.
3. Dimension "E" does not include inter-lead Flash or protrusion. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010") per side.
4. "L" is the length of the terminal for soldering to a substrate.
5. The lead width "B", as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm
(0.024") per side.
A 0.0926 0.1043
A1 0.0040 0.0118
b 0.0130 0.0200 5
C 0.0091 0.0125
D 0.3977 0.4133 2
E 0.2914 0.2992 3
H 0.3940 0.4190
L 0.0160 0.050 4
e 0.050 BSC
Printed on recycled paper.
1113I–SEEPR–6/03 xM
Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use
as critical components in life support devices or systems.
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Tel: 1(408) 441-0311
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®
and combinations thereof, are the registered trade-
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AT25HP256-10PI-1.8

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Description:
IC EEPROM 256K SPI 10MHZ 8DIP
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