MIC4421/4422 Micrel, Inc.
August 2005 7 M9999-081005
Applications Information
Supply Bypassing
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 10,000pF
load to 18V in 50ns requires 3.6A.
The MIC4421/4422 has double bonding on the supply pins,
the ground pins and output pins. This reduces parasitic
lead inductance. Low inductance enables large currents to
be switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at or
near the maximum rated voltage.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since it
is referenced to the same ground.
Figure 3. Direct Motor Drive
Figure 4. Self Contained Voltage Doubler
30
29
28
27
26
25
0 50 100 150 200 250 300 350
mA
12 Ω LIN
E
OUTPUT VOLTAGE vs LOAD CURRENT
VOLTS
DR I V E
LOGI C
Ø
1
DR I V E S I G N A L
CO N D U C TION A N G LE
CO N T R O L
0° TO 180°
CO N D U C TION A N G L
E
CONT ROL 1 80
° TO 36
MIC4451
V
S
1µF
V
S
MIC4452
V
S
1µF
V
S
Ø
1
M
Ø
3
Ø
2
PHAS E 1 of 3 PHA SE M O TOR
DRIV ER US IN G MIC4420/4429
MIC4421
1µF
50V
MKS
2
UN ITED CHEMC ON SX E
0.1µF
WIMA
MKS
2
1
8
6,
7
5
4
0.1µF
50V
5.6 kΩ
560
+15
560µF 50V
BYV 10 (x 2)
100µF 50V
(x2) 1N4448
2
+
+
+
To guarantee low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for
supply bypassing. Low inductance ceramic disk capacitors
with short lead lengths (< 0.5 inch) should be used. A 1µF low
ESR film capacitor in parallel with two 0.1µF low ESR ceramic
capacitors, (such as AVX RAM Guard
®
), provides adequate
bypassing. Connect one ceramic capacitor directly between
pins 1 and 4. Connect the second ceramic capacitor directly
between pins 8 and 5.
Grounding
The high current capability of the MIC4421/4422 demands
careful PC board layout for best performance. Since the
MIC4421 is an inverting driver, any ground lead impedance
will appear as negative feedback which can degrade switching
speed. Feedback is especially noticeable with slow-rise time
inputs. The MIC4421 input structure includes about 200mV
of hysteresis to ensure clean transitions and freedom from
oscillation, but attention to layout is still recommended.
Figure 5 shows the feedback effect in detail. As the MIC4421
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4421 ground pins. If the driving logic is
referenced to power ground, the effective logic input level is
reduced and oscillation may result.
To insure optimum performance, separate ground traces
should be provided for the logic and power connections. Con
-
necting the logic ground directly to the MIC4421 GND pins
will ensure full logic drive to the input and ensure fast output
switching. Both of the MIC4421 GND pins should, however,
still be connected to power ground.
MIC4421/4422 Micrel, Inc.
M9999-081005 8 August 2005
Table 1: MIC4421 Maximum
Operating Frequency
V
S
Max Frequency
18V 220kHz
15V 300kHz
10V 640kHz
5V 2MHz
Conditions: 1. θ
JA
= 150°C/W
2. T
A
= 25°C
3. C
L
= 10,000pF
dissipation limit can easily be exceeded. Therefore, some
attention should be given to power dissipation when driving
low impedance loads and/or operating at high frequency.
The supply current vs. frequency and supply current vs
capacitive load characteristic curves aid in determining
power dissipation calculations. Table 1 lists the maximum
safe operating frequency for several power supply volt
-
ages when driving a 10,000pF load. More accurate power
dissipation figures can be obtained by summing the three
dissipation sources.
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the
thermal resistance of the 8-pin plastic DIP package, from
the data sheet, is 130°C/W. In a 25°C ambient, then, using
a maximum junction temperature of 150°C, this package
will dissipate 960mW.
Accurate power dissipation numbers can be obtained by
summing the three sources of power dissipation in the
device:
• Load Power Dissipation (P
L
)
• Quiescent power dissipation (P
Q
)
• Transition power dissipation (P
T
)
Calculation of load power dissipation differs depending on
whether the load is capacitive, resistive or inductive.
Resistive Load Power Dissipation
Dissipation caused by a resistive load can be calculated
as:
P
L
= I
2
R
O
D
where:
I = the current drawn by the load
R
O
= the output resistance of the driver when the output
is high, at the power supply voltage used. (See data
sheet)
D = fraction of time the load is conducting (duty cycle)
Figure 5. Switching Time Degradation Due to
Negative Feedback
MIC4421
1
8
6, 7
5
4
+18
0.1µF
0.1µF
TEK CURRENT
PROBE 6302
2,500 pF
POLYCARBONATE
5.0V
0 V
18 V
0 V
300 mV
6 AMPS
PC TRACE RESISTANCE = 0.05Ω
LOGIC
GROUND
POWE
R
GROUND
WIMA
MKS-2
1 µF
Input Stage
The input voltage level of the MIC4421 changes the quies
-
cent supply current. The N channel MOSFET input stage
transistor drives a 320µA current source load. With a logic
“1” input, the maximum quiescent supply current is 400µA.
Logic “0” input level signals reduce quiescent current to
80µA typical.
The MIC4421/4422 input is designed to provide 300mV of
hysteresis. This provides clean transitions, reduces noise
sensitivity, and minimizes output stage current spiking
when changing states. Input voltage threshold level is ap
-
proximately 1.5V, making the device TTL compatible over
the full temperature and operating supply voltage ranges.
Input current is less than ±10µA.
The MIC4421 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38C42, and similar
switch mode power supply integrated circuits. By offloading
the power-driving duties to the MIC4421/4422, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
The input can be greater than the V
S
supply, however, cur-
rent will flow into the input lead. The input currents can be
as high as 30mA p-p (6.4mA
RMS
) with the input. No damage
will occur to MIC4421/4422 however, and it will not latch.
The input appears as a 7pF capacitance and does not
change even if the input is driven from an AC source.
While the device will operate and no damage will occur up
to 25V below the negative rail, input current will increase
up to 1mA/V due to the clamping action of the input, ESD
diode, and 1kΩ resistor.
Power Dissipation
CMOS circuits usually permit the user to ignore power
dissipation. Logic families such as 4000 and 74C have out
-
puts which can only supply a few milliamperes of current,
and even shorting outputs to ground will not force enough
current to destroy the device. The MIC4421/4422 on the
other hand, can source or sink several amperes and drive
large capacitive loads at high frequency. The package power
MIC4421/4422 Micrel, Inc.
August 2005 9 M9999-081005
Transition Power Dissipation
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for a
very brief interval, both the N- and P-channel MOSFETs in
the output totem-pole are ON simultaneously, and a current
is conducted through them from V
S
to ground. The transition
power dissipation is approximately:
P
T
= 2 f V
S
(A•s)
where (A•s) is a time-current factor derived from the typical
characteristic curve “Crossover Energy vs. Supply Volt
-
age.”
Total power (P
D
) then, as previously described is just
P
D
= P
L
+ P
Q
+ P
T
Definitions
C
L
= Load Capacitance in Farads.
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
f = Operating Frequency of the driver in Hertz
I
H
= Power supply current drawn by a driver when both
inputs are high and neither output is loaded.
I
L
= Power supply current drawn by a driver when both
inputs are low and neither output is loaded.
I
D
= Output current from a driver in Amps.
P
D
= Total power dissipated in a driver in Watts.
P
L
= Power dissipated in the driver due to the driver’s
load in Watts.
P
Q
= Power dissipated in a quiescent driver in Watts.
P
T
= Power dissipated in a driver when the output
changes states (“shoot-through current”) in Watts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers is
stated in Figure 7 in ampere-nanoseconds. This
figure must be multiplied by the number of repeti
-
tions per second (frequency) to find Watts.
R
O
= Output resistance of a driver in Ohms.
V
S
= Power supply voltage to the IC in Volts.
Capacitive Load Power Dissipation
Dissipation caused by a capacitive load is simply the energy
placed in, or removed from, the load capacitance by the
driver. The energy stored in a capacitor is described by the
equation:
E = 1/2 C V
2
As this energy is lost in the driver each time the load is charged
or discharged, for power dissipation calculations the 1/2 is
removed. This equation also shows that it is good practice
not to place more voltage in the capacitor than is necessary,
as dissipation increases as the square of the voltage applied
to the capacitor. For a driver with a capacitive load:
P
L
= f C (V
S
)
2
where:
f = Operating Frequency
C = Load Capacitance
V
S
= Driver Supply Voltage
Inductive Load Power Dissipation
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is in
the resistive case:
P
L1
= I
2
R
O
D
However, in this instance the R
O
required may be either
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is still
only half the story. For the part of the cycle when the induc
-
tor is forcing current through the driver, dissipation is best
described as
P
L2
= I V
D
(1 – D)
where V
D
is the forward drop of the clamp diode in the driver
(generally around 0.7V). The two parts of the load dissipation
must be summed in to produce P
L
P
L
= P
L1
+ P
L2
Quiescent Power Dissipation
Quiescent power dissipation (P
Q
, as described in the input
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
0.2mA; a logic high will result in a current drain of 3.0mA.
Quiescent power can therefore be found from:
P
Q
= V
S
[D I
H
+ (1 – D) I
L
]
where:
I
H
= quiescent current with input high
I
L
= quiescent current with input low
D = fraction of time input is high (duty cycle)
V
S
= power supply voltage

MIC4422YN

Mfr. #:
Manufacturer:
Microchip Technology / Micrel
Description:
Gate Drivers High Speed, 9A Low Side MOSFET Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union