Characteristics TN2540, TXN625, TYN625, TYN825, TYN1225
4/11 DocID7478 Rev 9
Figure 5. Relative variation of thermal
impedance versus pulse duration (TO-220AB
ins)
Figure 6. Relative variation of gate trigger,
holding, and latching currents versus junction
temperature
K=[Z /R
th th
]
1,0E-02
1,0E-01
1,0E+00
1,0E-03 1,0E-02 1,0E-01 1,0E+00 1,0E+01 1,0E+02 1,0E+03
t (s)
p
Z
th(j-c)
Z
th(j-a)
-40 -20 0 20 40 60 80 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I,I[T] /
GTHL j
I ,I ,I [T =25°C]
GTHL j
I
GT
I
H
& I
L
Figure 7. Surge peak on-state current versus
number of cycles
Figure 8. Non-repetitive surge peak on-state
current, and corresponding values of I
2
t
I(A)
TSM
0
50
100
150
200
250
300
350
1 10 100 1000
Non repetitive
T
j
initial=25 °C
Repetitive
T
C
=83°C
t =10ms
p
One cycle
Number of cycles
0.01 0.10 1.00 10.00
100
1000
2000
I (A), I t (A s)
TSM
22
Sinusoidal pulse width t (ms)
p
I t
2
I
TSM
T initial = 25°C
j
dI/dt limitation
Figure 9. On-state characteristics (maximum
values)
Figure 10. Thermal resistance junction to
ambient versus copper surface under tab
(D
2
PAK)
I (A)
TM
1
10
100
1000
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
T
j
max :
V
to
= 0.77V
R
d
= 14m˜
V (V)
TM
0 4 8 1216202428323640
0
10
20
30
40
50
60
70
80
S(cm²)
R (°C/W)
th(j-a)
Epoxy printed circuit board FR4,
copper thickness = 35 µm
