SpecNo. JEFL243C-0024A-01 P 7/9
MURATA MFG.CO.,LTD
Reference
Only
Pick- up nozzle
Support pin
P.C.B.
Product
16.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case of P.C.B. separation.
Products shall not be arranged on the line
of a series
of holes when there are big holes in P.C.B.
(Because the stress concentrate on the line of holes.)
< Products Placing >
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.7 Standard Land Dimensions(Reflow)
1 If the pattern is made with wider than 1.2mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
2 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be
occurred deu to the spread of soldering paste or mount placeing accuracy.
3 If the pattern is made with wider than 0.8mm, the strength of bending will be reduced.
4 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
16.8 Standard Soldering Condition
1.Reflow Soldering
(1)Standard printing pattern of solder paste
Thickness of the solder paste should be 100 to 150µm.
Use the stencil of the right figure.
For the resist and copper foil pattern, use standard
land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
Spread of soldering paste between lines may cause short
circuit of lines.
(2) Soldering Temperatutre
Temperature difference between soldering and surface of products must be within 150°C,
in preheating. When products are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, ferrite may be cracked and cause deterioration in
insulation resistance.
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
○
×
×
○
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
0.8
2.6
0.5
1.2
(in mm)
Product
P.C.B.
Hole
○
×
0.8
2.6
1.2
0.4
(in mm)
Resist
Copper foil pattern
No pattern
1
2
3