RUGGED RELIABILITY
• Meets VITA 66.1 and 66.4 standards
• Common protective cover is made
of anti-static material
• Receptacle (backplane) connector
includes two robust guide pins for
blind mating
• Connector mounting screws
contain pre-applied Nylok patch to
help withstand vibration
VERSATILE
• Full-size VITA 66.1 or half-size
VITA 66.4 modules
• Plug (daughtercard) connector
housing contains a slot feature to
facilitate cleaning the MT interfaces
• Locating post features helps ensure
proper position on the backplane
and daughtercard
HIGH PERFORMANCE
• Connectors designed to maximize
optical performance, accommodating
up to two MT ferrules
• Receptacle connector insert
floats relative to the shell, providing
±0.25 mm planar floating
alignment capability
APPLICATIONS
• Embedded Computing
• Avionics and Vetronics
• Secure Communications
• Processing
• Radar
• Imaging and Targeting
TE Connectivity’s (TE) Ruggedized Optical Backplane interconnect
system provides a high-density, blind-mate optical interconnect in a
backplane/daughtercard configuration. The fiber optic ribbon cable
interconnect feeds through the backplane to removable system modules
using MT ferrules.
The optical module are available in two sizes:
• VITA 66.1 modules are full width and accommodate two MT ferrules.
• VITA 66.4 modules are half width and hold a single MT ferrule. Two
modules can be fit into the same space as a VITA 66.1 modules.
Designed for rugged embedded computing applications, the optical
modules are compatible with VPX and other high-performance standards.
MECHANICAL/ENVIRONMENTAL
• Mating Force (per 12-fiber MT ferrule):
Min: 7.8 N (1.75 lb)
Max: 11.8 N (2.65 lb)
• Durability: 100 cycles, tested per EIA-455-21
• Shock: 50 g, sawtooth, 11 ms pulse duration, tested per TIA/EIA-455-14, condition E
• Random Vibration: 11.95 grms, 50 to 2000 Hz, 2 hr per plane.
Tested per TIA/EIA-455-11, test condition V1-D
• Storage Temperature: -55˚C to +85˚C
• Operating Temperature: -20˚C to +85˚C
• Thermal Aging: 168 hrs at +85˚C
• Humidity, Steady-State: 95% RH at 60˚C
• Temperature Cycling: 21 cycles between -20˚C and +85˚C
MATERIALS
• Connector Shell and Housing: Aluminum alloy 6061, clear-chromate
conversion-coated (RoHS compliant)
• Alignment Posts and Screws: Stainless steel, 300 series, passivated
(RoHS-compliant)
STANDARDS AND SPECIFICATIONS
• TE Application Specification:
VITA 66.1: 114-32050
VITA 66.4: 114-32144
• TE Product Specification:
VITA 66.1: 108-2467
VITA 66.4: 108-2467-1
• TE Qualification Test Report:
VITA 66.1: 501-134012
VITA 66.4: 501-134012-1
PAGE 2
RUGGEDIZED OPTICAL
BACKPLANE INTERCONNECTS
Support VITA 66.1 and 66.4 Standards
AEROSPACE, DEFENSE & MARINE /// RUGGEDIZED OPTICAL BACKPLANE INTERCONNECTS
TE Components . . . TE Technology . . . TE Know-how . . .
AMP | Agastat | CII | Hartman | Kilovac | Microdot | Nanonics | Polamco | Raychem | Rochester | DEUTSCH
SEACON Phoenix | L.L. Rowe | Phoenix Optix | AFP | SEACON
Get your product to market faster with a smarter, better solution.
