ADG719
Rev. D | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
Analog, Digital Inputs
1
−0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs
first
Peak Current, S or D 100 mA
(Pulsed at 1 ms, 10% duty
cycle max)
Continuous Current, S or D 30 mA
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP Package, Power Dissipation 315 mW
θ
JA
Thermal Impedance 206°C/W
θ
JC
Thermal Impedance 44°C/W
SOT-23 Package, Power Dissipation 282 mW
θ
JA
Thermal Impedance 229.6°C/W
θ
JC
Thermal Impedance 91.99°C/W
Lead Soldering
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
(<20 sec)
220°C
Soldering (Pb-Free)
Reflow, Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 20 sec to 40 sec
ESD 1 kV
1
Overvoltages at IN, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one maximum rating may be applied at any one time.
ESD CAUTION