NCL30080
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22
Reset
Stop
4−s
Timer
Run
BO_NOK high
or TSD
or CS_Short
WOD_SCP
or Aux_SCP
Timer has
finished
counting
BO_NOK high
or TSD
or CS_Short
Figure 38. State Diagram for B Version Faults
or V
CC
_OVP
V
CC
> V
CC(on)
V
CC
< V
CC(off)
V
CC
Disch.
V
CC
< V
CC(off)
or
BO_NOK
V
CC
_OVP
With states
: Reset
Stop
Run
V
CC
Disch.
4−s Timer
Controller is reset, I
CC
= I
CC(start)
Controller is ON, DRV is not switching
Normal switching
No switching, I
CC
= I
CC1
, waiting for V
CC
to decrease to V
CC(off)
the auto−recovery timer is counting, V
CC
is ramping up and down between V
CC(on)
and V
CC(off)
NCL30080
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23
Figure 39. State Diagram for A Version Faults
With states: Reset
Stop
Run
V
CC
Disch.
4−s Timer
Latch
Controller is reset, I
CC
= I
CC(start)
Controller is ON, DRV is not switching
Normal switching
No switching, I
CC
= I
CC1
, waiting for V
CC
to decrease to V
CC(off)
the auto−recovery timer is counting, V
CC
is ramping up and down between V
CC(on)
and V
CC(off)
Controller is latched off, V
CC
is ramping up and down between V
CC(on)
and V
CC(off)
,
only V
CC(reset)
can release the latch.
Reset
Stop
4−s
Timer
Run
BO_NOK high
or TSD
or CS_Short
Latch
WOD_SCP or
Aux_SCP
Timer has
finished
counting
BO_NOK high
or TSD
or CS_Short
V
CC
> V
CC(on)
V
CC
< V
CC(off)
V
CC
Disch.
V
CC
< V
CC(off)
or
BO_NOK
V
CC
_OVP
V
CC
< V
CC(reset)
V
CC
_OVP
NCL30080
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24
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
23
456
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX
MILLIMETERS
0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
e 0.85 0.95 1.05
L 0.20 0.40 0.60
0.25 BSC
L2
0° 10°
1.30 1.50 1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
DETAIL Z
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M

NCL30080BSNT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
LED Lighting Drivers PRIMARY SIDE CC FOR LED
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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