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PRELIMINARY
PROTECTION PRODUCTS
EClamp2465T
Device Connection
The EClamp2465T designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. Note that the ESD protection diodes are
located at pins 1 - 3 for the data and clock lines. This
means the device is directional. Therefore, Pins 1 - 3
must be routed to the SIM connector while pins 6 - 8
are routed to the protected IC. Pin 5 is routed to the
Vcc pin of the SIM connector. Typical layout examples
are shown in Figure 3. All path lengths should be kept
as short as possible to minimize the effects of parasitic
inductance in the board traces. The center tab should
be connected directly to the ground plane. Multiple
micro-vias are recommended in the device ground pad
as shown in Figure 2. Multiple vias in the device
ground pad will result in a lower inductive ground loop,
increasing the ESD effectiveness of the device.
Figure 1 - Pin Identification and Configuration
(Top Side View)
Figure 3 - SIM Protection Layout Examples
Data to Connector
CLK to Connector
Reset to Connector
Data to IC
CLK to IC
Reset to IC
Vcc to Connector
1
45
8
Gnd
NC
Figure 2 - Recommended Layout Using Ground Vias
