NFW31SP206X1E4L

Spec. No. JENF243E-0009J-01 P4/ 10
MURATA MFG. CO., LTD.
Reference Only
9. Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
9.1 Temperature
Cycle
Meet table 3.
1 Cycle:
1 step :
- 40
°C (+ 0°C, - 3°C) / 30 minutes
2 step : Room Temperature / within 5 minutes
3 step :
+85 °C (+ 3°C, - 0°C)
/ 30 minutes
4 step : Room Temperature / within 5 minutes
Total of 10 cycles
Then measured after exposure in the room condition
for 4 to 48 hours.
Initial values: Then measured after heat treatment
(150°C (+0°C,-10°C), 1 hour) and exposure in the
room condition for 4 to 48 hours.
9.2 Humidity Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 1000 h (+ 48h , - 0h)
Then measured after exposure in the room condition
for 4 to 48 hours.
9.3 Heat
Resistance
Temperature : 85 ± 2 °C
Time : 1000 h (+ 48h , - 0h)
Then measured after exposure in the room condition
for 4 to 48 hours.
9.4 Cold
Resistance
Temperature : -55 ± 2 °C
Time : 500 h (+ 24h , - 0h)
Then measured after exposure in the room condition
for 4 to 48 hours.
9.5 Humidity Load Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Test Voltage : Rated Voltage
Time : 500 h (+ 24h , - 0h)
Then measured after exposure in the room condition
for 4 to 48 hours.
9.6 Heat Life Temperature : 85 ± 3 °C
Test Voltage : Rated Voltage × 200%
Time : 1000 h (+ 48h , - 0h)
Charge Current: 10mA max.
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide plastic tape)
1.9±0.2
4.0±0.1
2.0±0.1
0.2±0.1
φ
1.5
3.6±0.2
3.5±0.05
1.75
±0.1
8.0±0.2
+0.1
-0
Direction of feed
4.0±0.1
2.0±0.05
(in mm)
Dimension of the Cavity is
measured at the bottom side.
Spec. No. JENF243E-0009J-01 P5/ 10
MURATA MFG. CO., LTD.
Reference Only
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2000 pcs. / reel
(2) Packing Method
Products shall be packaged in the each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape has no spliced point
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic Tape 5N min.
Cover Tape 10N min.
10.4. Peeling off force of cover tape
0.2 to 0.7N(minimum value is typical.)
Speed of peeling off : 300mm / minute
10.5. Dimensions of Leader-tape , Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. » □□
OOOO ×××
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
165 to 180 degree
F
Cover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
Spec. No. JENF243E-0009J-01 P6/ 10
MURATA MFG. CO., LTD.
Reference Only
10.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
(a) Standard land dimensions
Side on which chips are mounted
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment (automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content
exceeding 0.2(wt) %).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface
is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the
temperature difference is limited to 100 °C max.
1.2
2.2
4.2
1.0
2.6
3.0
0.6
Resist
Copper foil pattern
No pattern
Small diameter thru hole (
φ
0.4)
(in mm)
W
D
Label
H

NFW31SP206X1E4L

Mfr. #:
Manufacturer:
Description:
EMI Network Filter 20MHZ C/O 25V 0.2A F
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