Feb. 2009
2
V
CE = VCES, VGE = 0V
±V
GE = VGES, VCE = 0V
T
j = 25°C
T
j = 125°C
V
CC = 600V, IC = 300A, VGE = 15V
V
CC = 600V, IC = 300A
V
GE = ±15V
R
G = 1.0Ω, Inductive load
I
E = 300A
I
E = 300A, VGE = 0V
IGBT part (1/2 module)
*1
FWDi part (1/2 module)
*1
Case to heat sink, Thermal compound Applied (1/2 module)
*1,*2
IC = 30mA, VCE = 10V
I
C = 300A, VGE = 15V
V
CE = 10V
V
GE = 0V
1200
±20
300
600
300
600
1890
–40 ~ +150
–40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
400
MITSUBISHI IGBT MODULES
CM300DY-24A
HIGH POWER SWITCHING USE
V
V
A
A
W
°C
°C
Vrms
N • m
g
1
0.5
3.0
—
47
4
0.9
—
550
180
600
350
250
—
3.8
0.066
0.12
—
16
mA
µA
nF
nC
ns
µC
V
K/W
Ω
—
—
2.1
2.4
—
—
—
1350
—
—
—
—
—
9.0
—
—
—
0.02
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.0
7V
V
68
ns
ICES
IGES
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (
Note 1
)
Qrr (
Note 1
)
VEC(
Note 1
)
Rth(j-c)Q
R
th(j-c)R
R
th(c-f)
RG
Symbol
Parameter
V
GE(th)
VCE(sat)
*
1 : Case temperature (TC), heat sink temperature (Tf) measured point is just under the chips.
*
2 : Typical value is measured by using thermally conductive grease of
λ
= 0.9[W/(m • K)].
Note 1. I
E, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (T
j) does not exceed Tjmax rating.
3. Junction temperature (T
j) should not increase beyond 150°C.
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Weight
G-E Short
C-E Short
DC, T
C = 80°C
*1
Pulse (Note 2)
Pulse (Note 2)
T
C = 25°C
*1
Terminals to base plate, f = 60Hz, AC 1 minute
Main terminals M6 screw
Mounting M6 screw
Typical value
Symbol Parameter
Collector current
Emitter current
Torque strength
Conditions UnitRatings
V
CES
VGES
IC
ICM
IE (
Note 1
)
IEM (
Note 1
)
PC (
Note 3
)
Tj
Tstg
Viso
—
—
—
Unit
Typ.
Limits
Min. Max.
Test conditions
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Collector cutoff current
Gate-emitter threshold
voltage
Gate leakage current
Collector-emitter saturation
voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Contact thermal resistance
External gate resistance
Thermal resistance