Dynamic, Self-Calibrating, Peak-Detecting, Differential
Hall Effect Gear Tooth Sensor IC
ATS617LSG
13
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Peak Detecting vs. AC-Coupled Filters High-pass filter-
ing (normal AC coupling) is a commonly used technique for
eliminating circuit offsets. However, AC coupling has errors at
power-on because the filter circuit needs to hold the circuit zero
value even though the circuit may power-on over a large signal.
Such filtering techniques can only perform properly after the
filter has been allowed to settle, which typically takes longer than
1s. Also, high-pass filter solutions cannot easily track rapidly
changing baselines, such as those caused by eccentricities. (The
term baseline refers to a 0 G differential field, where each Hall-
effect element is subject to the same magnetic field strength; see
figure 3.) In contrast, peak detecting designs switch at the change
in slope of the differential signal, and so are baseline-independent
both at power-on and while running.
Peak Detecting vs. Zero-Crossing Reference The usual
differential zero-crossing sensor ICs are susceptible to false
switching due to off-center and tilted installations that result in a
shift of the baseline that changes with air gap. The track-and-hold
peak detection technique ignores baseline shifts versus air gaps
and provides increased immunity to false switching. In addition,
using track-and-hold peak detection techniques, increased air gap
capabilities can be expected because peak detection utilizes the
entire peak-to-peak signal range, as compared to zero-crossing
detectors, which switch at half the peak-to-peak signal.
Power-On Operation The device powers-on in the Off state
(output voltage high), irrespective of the magnetic field condi-
tion. The circuit is then ready to accurately detect the first target
edge that results in a high-to-low transition of the device output.
Undervoltage Lockout (UVLO) When the supply voltage,
V
CC
, is below the minimum operating voltage, V
CC(UV)
, the
device is off and stays off, irrespective of the state of the mag-
netic field. This prevents false signals, which may be caused
by undervoltage conditions (especially during power-up), from
appearing at the output.
Output. The device output is an open-drain stage. An external
pull-up (resistor) must be supplied to a supply voltage of not
more than V
CC
(max).
Output Polarity. The output of the unit will switch from low
to high as the leading edge of a tooth passes the branded face of
the package in the direction indicated in figure 6. This means that
in such a configuration, the output voltage will be high when the
package is facing a tooth. If the target rotation is in the oppo-
site direction relative to the package, the output polarity will be
opposite as well, with the unit switching from low to high as the
leading edge passes the unit.
of Package
Rotating Target
Branded Face
1
4
Figure 6. This left-to-right (pin 1 to pin 4) direction of target rotation
results in a high output signal when a tooth of the target gear is nearest
the branded face of the package. A right-to-left (pin 4 to pin 1) rotation
inverts the output signal polarity.
Figure 7. The magnetic profile reflects the geometry of the target, allowing the device to present an accurate digital output response.
Target
Mechanical Profile
Target
Magnetic Profile
IC Output
Electrical Profile
Target Motion from
Pin 1 to Pin 4
IC Output
Electrical Profile
Target Motion from
Pin 4 to Pin 1
Signature Tooth
B+
B
IN
V+
V
OUT
V+
V
OUT
IC Output
Switch State
On Off On Off On Off On Off On OffOn OffOn OffOn Off
Dynamic, Self-Calibrating, Peak-Detecting, Differential
Hall Effect Gear Tooth Sensor IC
ATS617LSG
14
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Power Derating
The device must be operated below the maximum junction
temperature of the device, T
J(max)
. Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating T
J
. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, R
JA
, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, R
JC
, is relatively
small component of R
JA
. Ambient air temperature, T
A
, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, P
D
), can
be estimated. The following formulas represent the fundamental
relationships used to estimate T
J
, at P
D
.
P
D
= V
IN
×
I
IN
(1)
 T = P
D
×
R
JA
(2)
T
J
= T
A
+ ΔT (3)
For example, given common conditions such as: T
A
= 25°C,
V
CC
= 12 V, I
CC
= 6 mA, and R
JA
= 126 °C/W, then:
P
D
= V
CC
×
I
CC
= 12 V
×
6 mA = 72 mW
T = P
D
×
R
JA
= 72 mW
×
126 °C/W = 9°C
T
J
= T
A
+ T = 25°C + 9°C = 34°C
A worst-case estimate, P
D
(max), represents the maximum allow-
able power level (V
CC
(max), I
CC
(max)), without exceeding
T
J
(max), at a selected R
JA
and T
A
.
Example: Reliability for V
CC
at T
A
=
150°C, package SG, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
R
JA
=
126 °C/W, T
J
(max)
=
165°C, V
CC
(max)
=
24
V, and
I
CC
(max)
=
12
mA.
Calculate the maximum allowable power level, P
D
(max). First,
invert equation 3:
T
max
= T
J
(max) – T
A
= 165
°C
150
°C = 15
°C
This provides the allowable increase to T
J
resulting from internal
power dissipation. Then, invert equation 2:
P
D
(max)
= T
max
÷ R
JA
= 15°C ÷ 126 °C/W = 119 mW
Finally, invert equation 1 with respect to voltage:
V
CC
(est) = P
D
(max)
÷ I
CC
(max) = 119 mW ÷ 12 mA = 9.92 V
The result indicates that, at T
A
, the application and device can
dissipate adequate amounts of heat at voltages V
CC
(est).
Compare V
CC
(est) to V
CC
(max). If V
CC
(est) V
CC
(max), then
reliable operation between V
CC
(est) and V
CC
(max) requires
enhanced R
JA
. If V
CC
(est) V
CC
(max), then operation between
V
CC
(est) and V
CC
(max) is reliable under these conditions.
This value applies only to the voltage drop across the ATS617
chip. If a protective series diode or resistor is used, the effec-
tive maximum supply voltage is increased. For example, when a
standard diode with a 0.7 V drop is used:
V
CC
(max) = 9.9 V + 0.7 V = 10.6 V
Dynamic, Self-Calibrating, Peak-Detecting, Differential
Hall Effect Gear Tooth Sensor IC
ATS617LSG
15
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
0.71±0.05
5.50±0.05
4.70±0.10
0.60±0.10
0.40±0.10
24.65±0.10
15.30±0.10
1.0 REF
0.71±0.10 0.71±0.10
1.60±0.10
1.27±0.10
5.50±0.10
8.00±0.05
5.80±0.05
1.70±0.10
243
1
A
A
D
B
For Reference Only, not for tooling use (reference DWG-9002)
Dimensions in millimeters
A
B
C
C
D
E
F
F
Dambar removal protrusion (16X)
Metallic protrusion, electrically connected to pin 4 and substrate (both sides)
Thermoplastic Molded Lead Bar for alignment during shipment
E
E2E1
Hall elements (E1, E2), not to scale
Active Area Depth, 0.43 mm
Branded
Face
Standard Branding Reference View
= Supplier emblem
L = Lot identifier
N = Last three numbers of device part number
Y = Last two digits of year of manufacture
W = Week of manufacture
LLLLLLL
YYWW
NNN
Branding scale and appearance at supplier discretion
0.38
+0.06
–0.04
2.20
Package SG 4-Pin SIP

ATS617LSGTN-T

Mfr. #:
Manufacturer:
Description:
MAGNETIC SWITCH SPEC PURP 4SIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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