Figure 6: 78-Ball FBGA Die Rev. N (package code RKB)
Seating plane
0.12 A
Ball A1 ID
(covered by SR)
Ball A1 ID
A
0.25 MIN
1.1 ±0.1
6.4 CTR
8 ±0.1
0.8 TYP
9.6 CTR
10.5 ±0.1
0.8 TYP
78X Ø0.45
Dimensions apply to
solder balls post reflow
on Ø0.33 NSMD ball pads.
123789
A
B
C
D
E
F
G
H
J
K
L
M
N
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
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All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
8Gb: x4, x8 TwinDie DDR3L SDRAM
Package Dimensions
PDF: 09005aef85b50b74
DDR3L_8Gb_x4_x8_2CS_TwinDie_V90B.pdf - Rev. J 6/15 EN
14
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