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ZXMN3G32DN8TA
P1-P3
P4-P6
P7-P8
ZXMN3G32DN8
Issue 1 - January 2008
4
www
.zetex.com
© Zetex Semiconductors plc 2008
Electrical characteristics (at T
amb
= 25°C unless otherwise stated)
Parameter
Symbol
Min.
T
yp.
Max.
Unit
Conditions
Static
Drain-Source Breakdown
Vo
l
t
a
g
e
V
(BR)DSS
30
V
I
D
= 250
µ
A, V
GS
=0V
Zero Gate V
oltage Drain
Current
I
DSS
0.5
µ
AV
DS
= 30V
, V
GS
=0V
Gate-Body Leakage
I
GSS
100
nA
V
GS
=±20V
, V
DS
=0V
Gate-Source Thresh
old
Vo
l
t
a
g
e
V
GS(th)
1.0
3.0
V
I
D
= 250
µ
A, V
DS
=V
GS
Static Drain-Source
On-State Resistance
(*)
NOTES:
(*)
Measured under pulsed
conditions. Pu
lse width
≤
300
µ
s; duty cycle
≤
2%.
R
DS(on)
0.028
0.045
Ω
Ω
V
GS
= 10V
, I
D
= 6.0A
V
GS
= 4.5V
, I
D
= 4.9A
Forward
T
ransconductance
(*)(†)
g
fs
12
S
V
DS
= 15V
, I
D
= 6.0A
Dynamic
(†)
(†)
For design aid on
ly, not subject to pro
duction testing
Input Capacitance
C
iss
472
pF
V
DS
= 15V
, V
GS
=0V
f=1MHz
Output Capacitance
C
oss
178
pF
Reverse T
ransfer
Capacitance
C
rss
65
pF
Switching
(‡)(†)
(‡)
Switching characteristics are independ
ent of operating junction
temperature.
Tu
r
n
-
O
n
-
D
e
l
a
y
Ti
m
e
t
d(on)
2.5
ns
V
DD
= 15V
, I
D
= 1A
R
G
≅
6.0
Ω,
V
GS
=10V
Rise T
ime
t
r
3.1
ns
T
u
rn-Off Delay
T
ime
t
d(off)
14
ns
Fall T
ime
t
f
9.7
ns
T
otal Gate Charge
Q
g
10.5
nC
V
DS
= 15V
, V
GS
= 10V
I
D
= 6A
Gate-Source Charge
Q
gs
1.86
nC
Gate Drain Charge
Q
gd
2.3
nC
Source-drain diode
Diode Forward V
oltage
(*)
V
SD
0.68
1.2
V
T
j
=25
°
C, I
S
= 1.7A,
V
GS
=0V
ZXMN3G32DN8
Issue 1 - January 2008
5
www
.zetex.com
© Zetex Semiconductors plc 2008
T
ypical characteristics
ZXMN3G32DN8
Issue 1 - January 2008
6
www
.zetex.com
© Zetex Semiconductors plc 2008
T
est circuits
P1-P3
P4-P6
P7-P8
ZXMN3G32DN8TA
Mfr. #:
Buy ZXMN3G32DN8TA
Manufacturer:
Diodes Incorporated
Description:
MOSFET 30V Dual N-Channel Enhance. Mode MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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ZXMN3G32DN8TA