IXFK48N55

1 - 2
© 2000 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 550 V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 MW 550 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
T
C
= 25°C48A
I
DM
T
C
= 25°C, pulse width limited by T
JM
192 A
I
AR
T
C
= 25°C44A
E
AR
T
C
= 25°C60mJ
E
AS
T
C
= 25°C3J
dv/dt I
S
£ I
DM
, di/dt £ 100 A/ms, V
DD
£ V
DSS
5 V/ns
T
J
£ 150°C, R
G
= 2 W
P
D
T
C
= 25°C 560 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.063 in.) from case for 10 s 300 °C
M
d
Mounting torque TO-264 0.9/6 Nm/lb.in.
Weight PLUS 247 6 g
TO-264 10 g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS
= 0 V, I
D
= 3mA 550 V
V
GS(th)
V
DS
= V
GS
, I
D
= 8mA 2.5 4.5 V
I
GSS
V
GS
= ±20 V, V
DS
= 0 ±200 nA
I
DSS
V
DS
= V
DSS
100 mA
V
GS
= 0 V T
J
= 125°C2 mA
R
DS(on)
V
GS
= 10 V, I
D
= 0.5 • I
D25
110 mW
Note 1
Features
International standard packages
Low R
DS (on)
HDMOS
TM
process
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
Fast intrinsic rectifier
Applications
DC-DC converters
Battery chargers
Switched-mode and resonant-mode
power supplies
DC choppers
AC motor control
Temperature and lighting controls
Advantages
PLUS 247
TM
package for clip or spring
mounting
Space savings
High power density
HiPerFET
TM
Power MOSFETs
Single MOSFET Die
Avalanche Rated
98712 (3/24/00)
PLUS 247
TM
(IXFK)
G
D
(TAB)
G = Gate D = Drain
S = Source TAB = Drain
V
DSS
= 550 V
I
D25
= 48 A
R
DS(on)
= 110mW
t
rr
£ 250 ns
S
G
D
(TAB)
TO-264 AA (IXFK)
Preliminary data
IXFK 48N55
IXFX 48N55
IXYS reserves the right to change limits, test conditions, and dimensions.
2 - 2
© 2000 IXYS All rights reserved
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
g
fs
V
DS
= 10 V; I
D
= 0.5 • I
D25
Note 1 30 40 S
C
iss
8900 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 1000 pF
C
rss
330 pF
t
d(on)
42 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
55 ns
t
d(off)
R
G
= 1 W (External), 110 ns
t
f
45 ns
Q
g(on)
330 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
60 nC
Q
gd
65 nC
R
thJC
0.22 K/W
R
thCK
0.15 K/W
Source-Drain Diode Characteristic Values
(T
J
= 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
V
GS
= 0 V 48 A
I
SM
Repetitive; 192 A
pulse width limited by T
JM
V
SD
I
F
= I
S
, V
GS
= 0 V, Note 1 1.3 V
t
rr
250 ns
Q
RM
1.4 mC
I
RM
8A
I
F
= I
S
, -di/dt = 100 A/ms, V
R
= 100 V
Note: 1. Pulse test, t £ 300 ms, duty cycle d £ 2 %
IXFK 48N55
IXFX 48N55
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A
1
2.29 2.54 .090 .100
A
2
1.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b
1
1.91 2.13 .075 .084
b
2
2.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 .244
R 4.32 4.83 .170 .190
PLUS247
TM
(IXFX) Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
TO-264 AA Outline
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025

IXFK48N55

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 550V 48A TO-264AA
Lifecycle:
New from this manufacturer.
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