Philips Semiconductors
PCKEP14
2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver
Product data Rev. 01 — 30 October 2002 13 of 15
9397 750 09565
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
13.5 Package related soldering information
[1] For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
.
[3] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[5] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[6] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
14. Revision history
Table 11: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
[1]
Soldering method
Wave Reflow
[2]
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable
[3]
suitable
PLCC
[4]
, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
[4][5]
suitable
SSOP, TSSOP, VSO not recommended
[6]
suitable
Table 12: Revision history
Rev Date CPCN Description
01 20021030 - Product data (9397 750 09565)
Engineering Change Notice 853-2373 28877 (date: 20020909)
9397 750 09565
Philips Semiconductors
PCKEP14
2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data Rev. 01 — 30 October 2002 14 of 15
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825
15. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
17. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Level Data sheet status
[1]
Product status
[2][3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2002.
Printed in the U.S.A
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 30 October 2002 Document order number: 9397 750 09565
Contents
Philips Semiconductors
PCKEP14
2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.1 Power supply connection . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
11 Application information. . . . . . . . . . . . . . . . . . . 9
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
13.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
13.5 Package related soldering information . . . . . . 13
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14
16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

PCKEP14PW,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC CLK BUFFER 2:5 2GHZ 20TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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