MP1493 – 3A, 4.2V-16V INPUT, FAST TRANSIENT SYNCHRONOUS STEP-DOWN CONVERTER
MP1493 Rev. 1.11 www.MonolithicPower.com 2
9/21/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number OCP Protection Package Top Marking Free Air Temperature (T
A
)
MP1493DS*
Latch-off Mode
MP1493
MP1493DS-A
Hiccup Mode
SOIC8
MP1493-A
-40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP1493DS–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP1493DS–LF–Z)
PACKAGE REFERENCE
SOIC8
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage V
IN
....................................... 19V
V
SW
........................................-0.3V to V
IN
+ 0.3V
V
BST
...................................................... V
SW
+ 6V
All Other Pins..................................-0.3V to +6V
Continuous Power Dissipation (T
A
= +25°C)
(2)
SOIC8 ...................................................... 1.39W
Junction Temperature ..............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
...........................4.2V to 16V
Output Voltage V
OUT
.....................0.805V to 13V
Maximum Junction Temp. (T
J
) .............. +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
SOIC8..................................... 90 ...... 45... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
