BSO033N03MSGXUMA1

BSO033N03MS G
OptiMOS™3 M-Series Power-MOSFET
Features
• Optimized for 5V driver application (Notebook, VGA, POL)
• Low FOM
SW
for High Frequency SMPS
• 100% Avalanche tested
• N-channel
• Very low on-resistance R
DS(on)
@ V
GS
=4.5 V
• Excellent gate charge x R
DS(on)
product (FOM)
• Qualified for consumer level application
• Pb-free plating; RoHS compliant
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
10 secs steady state
Continuous drain current
1)
I
D
V
GS
=10 V, T
A
=25 °C
22 17 A
V
GS
=10 V, T
A
=90 °C
15 12.1
V
GS
=4.5 V, T
A
=25 °C
21 16
V
GS
=4.5 V, T
A
=90 °C
14.3 11.3
Pulsed drain current
2)
I
D,pulse
T
A
=25 °C
Avalanche current, single pulse
3)
I
AS
T
A
=25 °C
Avalanche energy, single pulse
E
AS
I
D
=22 A, R
GS
=25
mJ
Gate source voltage
V
GS
V
Power dissipation
1)
P
tot
T
A
=25 °C
2.5 1.56 W
Operating and storage temperature
T
j
, T
stg
°C
IEC climatic category; DIN IEC 68-1
55/150/56
Value
154
22
150
±20
-55 ... 150
Type Package Marking
BSO033N03MS G PG-DSO-8 033N03MS
PG-DSO-8
V
DS
30 V
R
DS(on),max
V
GS
=10 V 3.3
m
V
GS
=4.5 V 3.8
I
D
22 A
Product Summary
Rev.1.1 page 1 2009-11-19
BSO033N03MS G
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - soldering point
R
thJS
- - 35 K/W
Thermal resistance,
junction - ambient
R
thJA
minimal footprint,
t
p
10 s
- - 110
minimal footprint,
steady state
- - 150
6 cm
2
cooling area
1)
,
t
p
10 s
--50
6 cm
2
cooling area
1)
,
steady state
--80
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=1 mA
30 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=250 µA
1-2
Zero gate voltage drain current
I
DSS
V
DS
=30 V, V
GS
=0 V,
T
j
=25 °C
- 0.1 10 µA
V
DS
=30 V, V
GS
=0 V,
T
j
=125 °C
- 10 100
Gate-source leakage current
I
GSS
V
GS
=16 V, V
DS
=0 V
- 10 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=4.5 V, I
D
=21 A
- 3.0 3.8
m
V
GS
=10 V, I
D
=22 A
- 2.8 3.3
Gate resistance
R
G
0.9 1.9 3.3
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=22 A
46 93 - S
3)
See figure 13 for more detailed information
Values
1)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
2)
See figure 3 for more detailed information
Rev.1.1 page 2 2009-11-19
BSO033N03MS G
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 7200 9600 pF
Output capacitance
C
oss
- 1900 2500
Reverse transfer capacitance
C
rss
- 150 -
Turn-on delay time
t
d(on)
-27-ns
Rise time
t
r
- 12.8 -
Turn-off delay time
t
d(off)
-38-
Fall time
t
f
-14-
Gate Char
g
e Characteristics
4)
Gate to source charge
Q
gs
-19-nC
Gate charge at threshold
Q
g(th)
-11-
Gate to drain charge
Q
gd
- 9.6 -
Switching charge
Q
sw
-17-
Gate charge total
Q
g
-4560
Gate plateau voltage
V
plateau
- 2.6 - V
Gate charge total
Q
g
V
DD
=15 V, I
D
=22 A,
V
GS
=0 to 10 V
- 93 124 nC
Gate charge total, sync. FET
Q
g(sync)
V
DS
=0.1 V,
V
GS
=0 to 4.5 V
-3952
Output charge
Q
oss
V
DD
=15 V, V
GS
=0 V
-5168
Reverse Diode
Diode continuous forward current
I
S
- - 3.6 A
Diode pulse current
I
S,pulse
- - 154
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=22 A,
T
j
=25 °C
- 0.82 1 V
Reverse recovery charge
Q
rr
V
R
=15 V, I
F
=I
S
,
di
F
/dt =400 A/µs
- - 20 nC
4)
See figure 16 for gate charge parameter definition
T
A
=25 °C
Values
V
GS
=0 V, V
DS
=15 V,
f =1 MHz
V
DD
=15 V, V
GS
=4.5 V,
I
D
=22 A, R
G
=1.6
V
DD
=15 V, I
D
=22 A,
V
GS
=0 to 4.5 V
Rev.1.1 page 3 2009-11-19

BSO033N03MSGXUMA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-Ch 30V 22A DSO-8 OptiMOS 3M
Lifecycle:
New from this manufacturer.
Delivery:
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