Spec No. JELF243B-0005Q-01 P.3/9
MURATA MFG.CO., LTD
Reference
Only
No. Item Specification Test Method
7.2 Bending Test Chip coil shall not be damaged
after tested as test method.
Substrate: Glass-epoxy substrate
(100mm40mm1.6mm)
(in mm)
Speed of Applying Force:1mm/ s
Deflection: 2mm
Hold Duration: 30s
7.3 Vibration Appearance: No damage
Inductance Change: within ±10%
Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1min
Total Amplitude: 1.5mm
Testing Time: A period of 2 h in each of 3 mutually
Perpendicular directions.
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered
with new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C/60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s ±1s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C/60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Heat
Resistance
Appearance: No damage
Inductance Change: within ±10%
Q Change: within ±20%
Temperature: 85°C±2°C
Time: 1000 h (+48h, -0h)
Then measured after exposure in the room condition
for 48h±2h.
8.2 Cold
Resistance
Temperature: - 40°C±2°C
Time: 1000 h (+48h, -0h)
Then measured after exposure in the room condition
for 48h±2h.
8.3 Humidity Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000 h (+48h,-0h)
Then measured after exposure in the room condition
for 48h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step: - 40°C±2°C/ 30 min±3 min
2 step: Ordinary temp./ 10 min to 15 min
3 step: +85°C±2°C/ 30 min± 3 min
4 step: Ordinary temp./ 10 min to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 48h±2h.
45
R340
F
Deflection
45
Product
Pressure jig
