MC74HC541ANG

MC74HC541A
http://onsemi.com
4
Figure 2. Switching Waveform
V
CC
GND
INPUT A
OUTPUT Y
t
PLH
OE1 or OE2
50%
V
CC
GND
OUTPUT Y
t
PZL
OUTPUT Y
t
PZH
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
10%
90%
t
PLZ
t
PHZ
50%
50%
t
PHL
90%
50%
10%
t
r
t
TLH
t
f
t
THL
Figure 3. Switching Waveform
90%
50%
10%
50%
C
L
*
*Includes all probe and jig capacitance
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Test Circuit
Figure 5. Test Circuit
C
L
*
*Includes all probe and jig capacitance
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
1 kW
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
and t
PZH
.
MC74HC541A
http://onsemi.com
5
PIN DESCRIPTIONS
INPUTS
A1, A2, A3, A4, A5, A6, A7, A8 (PINS 2, 3, 4, 5, 6, 7, 8, 9)
Data input pins. Data on these pins appear in non−inverted
form on the corresponding Y outputs, when the outputs are
enabled.
CONTROLS
OE1, OE2 (PINS 1, 19)
Output enables (active−low). When a low voltage is
applied to both of these pins, the outputs are enabled and the
device functions as an non−inverting buffer. When a high
voltage is applied to either input, the outputs assume the high
impedance state.
OUTPUTS
Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8 (PINS 18, 17, 16, 15, 14,
13, 12, 11)
Device outputs. Depending upon the state of the output
enable pins, these outputs are either non−inverting outputs
or high−impedance outputs.
V
CC
To 7 Other Buffers
Figure 6. Logic Detail
One of Eight
Buffers
INPUT A
OE1
OE2
OUTPUT Y
ORDERING INFORMATION
Device Package Shipping
MC74HC541ADWG SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
MC74HC541ADWR2G SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
NLV74HC541ADWR2G* SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
MC74HC541ADTG TSSOP−20
(Pb−Free)
75 Units / Rail
MC74HC541ADTR2G TSSOP−20
(Pb−Free)
2500 Tape & Reel
NLV74HC541ADTR2G* TSSOP−20
(Pb−Free)
2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MC74HC541A
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

MC74HC541ANG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers 2-6V Octal 3-State Non-Inverting
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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