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LT3496EUFD#PBF
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P20
L
T3496
16
3496ff
t
y
p
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s
Buck-Boost Mode 300mA
×
6 LED Driver
T
riple Buck Mode LED Driver with Open LED Protection
PV
IN
10V TO 16V
470pF
OPEN
3496 TA05
SW1
SW2
PV
IN
PV
IN
L
T3496
GND
SW3
TG1
OVP1, OVP2, OVP3
TG1, TG2, TG3
VC1, VC2, VC3
V
REF
f
ADJ
CTRL1, CTRL2, CTRL3
CAP1, CAP2, CAP3
LED1, LED2, LED3
V
IN
PWM1, P
WM2, P
WM3
SHDN
PWM
SHDN
V
IN
3V TO 16V
C8
1
µF
6 LEDs
300mA
825k
M1
D2
D3
20k
OVP1-3
10k
LED3
1Ω
L1
10µH
L2
10µH
L3
10µH
CAP3
LED2
1Ω
CAP2
D1
C2
0.1
µF
C4
0.1
µF
C6
0.1
µF
C3
1
µF
LED1
1Ω
CAP1
C1
2.2µF
C5
1
µF
PV
IN
C7
1
µF
C1: MURA
T
A GRM31MR71E225KA93
C2, C4, C6: MURA
T
A GRM21BR71H104KA01B
C3, C5, C7: MURA
T
A GRM31MR71H105KA88
C8: MURA
T
A GRM31MR71E105KA93
D1-D3: DIODES DFLS160
L1-L3: T
AIYO YUDEN NP04SZB 100M
M1: ZETEX ZXMP6A13F
0.5A
C4
0.47µF
C5
0.47µF
C6
0.47µF
D1
D2
D3
5.6k
5.6k
20k
20k
2k
2k
LED1
M1
M2
M3
200mΩ
200mΩ
TG1
PV
IN
12V TO 40V
L1
10µH
L2
10µH
L3
10µH
M4
OVP1
OVP2
M5
M6
CAP1
0.5A
LED2
TG2
CAP2
0.5A
LED3
C1-C3
1
µF
s
3
200mΩ
470pF
3496 TA02
TG3
CAP3
SW1
SW2
L
T3496
GND
SW3
TG1, TG2, TG3
OVP1, OVP2, OVP3
VC1, VC2, VC3
V
REF
f
ADJ
CTRL1, CTRL2, CTRL3
CAP1, CAP2, CAP3
LED1, LED2, LED3
V
IN
PWM1, P
WM2, P
WM3
SHDN
PWM1, P
WM2, P
WM3
SHDN
V
IN
3V TO 24V
C7
1
µF
5.6k
20k
2k
22k
OVP1
C1-C3, C7: MURA
T
A GRM31MR71H105KA88
C4-C6: MURA
T
A GRM188R71C474KA88
D1-D3: DIODES DFLS160
L1-L3: T
AIYO YUDEN NP04SZB 100M
M1-M3: ZETEX ZXMP6A13F
M4-M6: PHILIPS BC858B
L
T3496
17
3496ff
p
a
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D
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FE28 (EB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0
o
– 8
o
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1
3
4
5
6
7
8
9
10
11
12
13
14
19
20
22
21
15
16
18
17
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
2.74
(.108)
28
2726
25
24
23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45
p
0.05
0.65 BSC
4.50
p
0.10
6.60
p
0.10
1.05
p
0.10
4.75
(.187)
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference L
TC DWG # 05-08-1663)
exposed pad Variation EB
L
T3496
18
3496ff
4.00
p
0.10
(2 SIDES)
2.50 REF
5.00
p
0.10
(2 SIDES)
NOTE:
1. DRA
WING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 V
ARIA
TION (WXXX-X).
2. DRA
WING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED P
AD ON BOT
TOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT
, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED P
AD SHALL BE SOLDER PLA
TED
6. SHADED AREA IS ONL
Y A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOT
TOM OF P
ACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
p
0.10
27
28
1
2
BOT
TOM VIEW—EXPOSED P
AD
3.50 REF
0.75
p
0.05
R = 0.115
T
YP
R = 0.05
T
YP
PIN 1 NOTCH
R = 0.20 OR 0.35
s
45
o
CHAMFER
0.25
p
0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD28) QFN 0506 REV B
RECOMMENDED SOLDER P
AD PITCH AND DIMENSIONS
APPL
Y SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
p
0.05
0.25
p
0.05
0.50 BSC
2.50 REF
3.50 REF
4.10
p
0.05
5.50
p
0.05
2.65
p
0.05
3.10
p
0.05
4.50
p
0.05
PACKAGE OUTLINE
2.65
p
0.10
3.65
p
0.10
3.65
p
0.05
p
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D
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UFD Package
28-Lead Plastic QFN (4mm
×
5mm)
(Reference L
TC DWG # 05-08-1712 Rev B)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P20
LT3496EUFD#PBF
Mfr. #:
Buy LT3496EUFD#PBF
Manufacturer:
Analog Devices / Linear Technology
Description:
LED Lighting Drivers High Current, 45V, 2.1MHz Triple Output LED Driver in 4x4 QFN
Lifecycle:
New from this manufacturer.
Delivery:
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TNT
EMS
Payment:
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