LT3496
16
3496ff
typical applications
Buck-Boost Mode 300mA × 6 LED Driver
Triple Buck Mode LED Driver with Open LED Protection
PV
IN
10V TO 16V
470pF
OPEN
3496 TA05
SW1 SW2
PV
IN
PV
IN
LT3496
GND
SW3 TG1
OVP1, OVP2, OVP3
TG1, TG2, TG3
VC1, VC2, VC3
V
REF
f
ADJ
CTRL1, CTRL2, CTRL3
CAP1, CAP2, CAP3
LED1, LED2, LED3
V
IN
PWM1, PWM2, PWM3
SHDN
PWM
SHDN
V
IN
3V TO 16V
C8
1µF
6 LEDs
300mA
825k
M1
D2 D3
20k
OVP1-3
10k
LED3
L1
10µH
L2
10µH
L3
10µH
CAP3
LED2
CAP2
D1
C2
0.1µF
C4
0.1µF
C6
0.1µF
C3
1µF
LED1
CAP1
C1
2.2µF
C5
1µF
PV
IN
C7
1µF
C1: MURATA GRM31MR71E225KA93
C2, C4, C6: MURATA GRM21BR71H104KA01B
C3, C5, C7: MURATA GRM31MR71H105KA88
C8: MURATA GRM31MR71E105KA93
D1-D3: DIODES DFLS160
L1-L3: TAIYO YUDEN NP04SZB 100M
M1: ZETEX ZXMP6A13F
0.5A
C4
0.47µF
C5
0.47µF
C6
0.47µF
D1 D2 D3
5.6k
5.6k
20k
20k
2k 2k
LED1
M1 M2 M3
200mΩ 200mΩ
TG1
PV
IN
12V TO 40V
L1
10µH
L2
10µH
L3
10µH
M4
OVP1
OVP2
M5
M6
CAP1
0.5A
LED2
TG2
CAP2
0.5A
LED3
C1-C3
1µF
s3
200mΩ
470pF
3496 TA02
TG3
CAP3
SW1 SW2
LT3496
GND
SW3
TG1, TG2, TG3
OVP1, OVP2, OVP3
VC1, VC2, VC3
V
REF
f
ADJ
CTRL1, CTRL2, CTRL3
CAP1, CAP2, CAP3
LED1, LED2, LED3
V
IN
PWM1, PWM2, PWM3
SHDN
PWM1, PWM2, PWM3
SHDN
V
IN
3V TO 24V
C7
1µF
5.6k
20k
2k
22k
OVP1
C1-C3, C7: MURATA GRM31MR71H105KA88
C4-C6: MURATA GRM188R71C474KA88
D1-D3: DIODES DFLS160
L1-L3: TAIYO YUDEN NP04SZB 100M
M1-M3: ZETEX ZXMP6A13F
M4-M6: PHILIPS BC858B
LT3496
17
3496ff
package Description
FE28 (EB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0o – 8o
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4
5
6
7
8 9 10
11
12 13 14
192022 21 151618 17
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
2.74
(.108)
28 2726 25 24 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45 p0.05
0.65 BSC
4.50 p0.10
6.60 p0.10
1.05 p0.10
4.75
(.187)
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
exposed pad Variation EB
LT3496
18
3496ff
4.00 p 0.10
(2 SIDES)
2.50 REF
5.00 p 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
27 28
1
2
BOTTOM VIEW—EXPOSED PAD
3.50 REF
0.75 p 0.05
R = 0.115
TYP
R = 0.05
TYP
PIN 1 NOTCH
R = 0.20 OR 0.35
s 45o CHAMFER
0.25 p 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD28) QFN 0506 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 p0.05
0.25 p0.05
0.50 BSC
2.50 REF
3.50 REF
4.10 p 0.05
5.50 p 0.05
2.65 p 0.05
3.10 p 0.05
4.50 p 0.05
PACKAGE OUTLINE
2.65 p 0.10
3.65 p 0.10
3.65 p 0.05
package Description
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)

LT3496EUFD#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LED Lighting Drivers High Current, 45V, 2.1MHz Triple Output LED Driver in 4x4 QFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union