DocID022284 Rev 3 13/15
ECMF06-6AM16 Recommendation on PCB assembly
15
4.2 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
4.3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
4.4 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
4.5 Reflow profile
Figure 21. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
250
0
50
100
150
200
240210180150120906030 300
270
-C/s
240-245 °C
2 - 3 °C/s
Temperature (°C)
-2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)
Ordering information ECMF06-6AM16
14/15 DocID022284 Rev 3
5 Ordering information
Figure 22. Ordering information scheme
For the latest information on available order codes see the product pages on www.st.com.
6 Revision history
Table 5. Ordering information
Order code Marking Package Weight Base qty Delivery mode
ECMF06-6AM16 KF Micro QFN-16L 6.3 mg 3000 Tape and reel
ECMF 06 - 6 A M16
Function
Common mode filter with ESD protection
Number of filtered lines
06 = Number of filtered lines
Number of ESD protected lines
6 = 6 lines with ESD protection
Version
A = Version
Package
M = Micro QFN, pitch 400 µm
16 = 16 pads
Table 6. Document revision history
Date Revision Changes
14-Feb-2012 1 Initial release.
04-Oct-2012 2 Inserted Table 3 and updated Figure 1 to add A1 marker.
26-may-2014 3 Updated Figure 21, Figure 22, Figure 22 and document reformatted.
DocID022284 Rev 3 15/15
ECMF06-6AM16
15
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ECMF06-6AM16

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
CMC 100MA 6LN SMD ESD
Lifecycle:
New from this manufacturer.
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