MP62260/MP62261 – CURRENT-LIMITED POWER DISTRIBUTION SWITCH
MP62260/MP62261 Rev. 0.9 www.MonolithicPower.com 2
4/6/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Enable Switch
Maximum
Continuous
Load Current
Typical Short-
Circuit Current
@ T
A
=25C
Package
Top
Marking
Free Air
Temperature (T
A
)
MP62260DS* Active Low Single 2A 3A SOIC8 TBD
MP62261DS Active High Single 2A 3A SOIC8 TBD
-40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP62260DS–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP62260DS–LF)
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS
(1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation (T
A
= +25°C)
(2)
SOIC8 ........................................................ 1.4W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature...............
-65°C to +150°C
Operating Junct. Temp. (T
J
)..... -40°C to +125°C
Thermal Resistance
(3)
θ
JA
θ
JC
SOIC8..................................... 90 ...... 42... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) Measured on JESD51-7, 4-layer PCB.
GND
IN
IN
EN*
OUT
OUT
OUT
FLAG
1
2
3
4
8
7
6
5
TOP VIEW
SOIC8
MP62260/MP62261
Single-Channel
(*is active high for MP62261)