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CPC1788J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
R06 www.ixysic.com 4
CPC1788
3 Performance Data @ 25°C (Unless Otherwise Noted)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
35
30
25
20
15
10
5
0
1.30 1.31 1.32 1.33 1.34
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA)
LED Forward Voltage (V)
35
30
25
20
15
10
5
0
2.15 2.50 2.85 3.553.20 3.90
Device Count (N)
Typical Turn-On Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Turn-On (ms)
0.080 0.110 0.1400.065 0.095 0.125
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Turn-Off (ms)
35
30
25
20
15
10
5
0
0.900 0.925 0.950 0.975 1.000 1.025
Device Count (N)
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
On-Resistance (Ω)
LED Forward Current (mA)
0
5 1015202530354045
50
12
11
10
9
8
7
6
5
4
3
2
1
0
Typical Turn-On Time
vs. LED Forward Current
(I
L
=250mA
DC
)
Turn-On (ms)
LED Forward Current (mA)
0
5 1015202530354045
0.145
0.140
0.135
0.130
0.125
0.120
0.115
0.110
0.105
0.100
50
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=250mA
DC
)
Turn-On (ms)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=250mA
DC
)
Temperature (ºC)
-40
7
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
Typical Turn-On Time vs. Temperature
(I
L
=250mA
DC
)
Temperature (ºC)
I
F
=10mA
I
F
=20mA
Turn-On (ms)
-40
0.24
0.21
0.18
0.15
0.12
0.09
0.06
0.03
-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(I
L
=250mA
DC
)
Temperature (ºC)
I
F
=20mA
I
F
=10mA
Turn-Off (ms)
I
NTEGRATED
C
IRCUITS
D
IVISION
5 www.ixysic.com R06
CPC1788
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=250mA
DC
)
Temperature (ºC)
On-Resistance (Ω)
-40
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=Max Rated)
Temperature (ºC)
On-Resistance (Ω)
Load Current (A)
0
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.1 0.2 0.4 0.50.3 0.6
Typical Load Current
vs. Load Voltage
(I
F
=10mA)
Load Voltage (V)
Temperature (ºC)
020406080 100
Load Current (A
DC
)
0
1
2
3
4
5
6
Maximum Load Current
vs. Temperature
(With Heat Sink)
1ºC/W
Free Air
10ºC/W
5ºC/W
-40
1160
1140
1120
1100
1080
1060
1040
1020
1000
-20 0 20 40 60 80 100
Blocking Voltage vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=1000V
P
)
Leakage (μA)
Temperature (ºC)
Load Current (A)
Energy Rating Curve
Free Air, No Heat Sink
15.0
13.5
12.0
10.5
9.0
7.5
6.0
4.5
3.0
1.5
0
10µs 100µs 1ms 10ms 100ms 1s 10s 100s
Time
I
NTEGRATED
C
IRCUITS
D
IVISION
R06 www.ixysic.com 6
CPC1788
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1788J MSL 1
Device Maximum Temperature x Time
CPC1788J 245°C for 30 seconds
e
3
P1-P3P4-P6P7-P7

CPC1788J

Mfr. #:
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Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount DC Only Single Pole i4-PAC
Lifecycle:
New from this manufacturer.
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