ADG786/ADG788
Rev. C | Page 11
OUTLINE DIMENSIONS
Figure 1. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
ADG786BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-6
ADG786BCPZ-REEL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-6
ADG786WBCPZ-REEL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-6
ADG788BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-6
ADG788BCPZ-REEL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
ADG788BCPZ-REEL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
EVAL-ADG788EBZ Evaluation Board
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADG786W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
a
pplications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
REVISION HISTORY
9/15—Rev. B to Rev. C
Change to Functional Block Diagrams .......................................... 1
Updated Outline Dimensions ........................................................ 11
Changes to Ordering Guide ........................................................... 11
10/13—Rev. A to Rev. B
Changed Off Isolation from −72 dB to −80 dB and Channel-to-
Channel Crosstalk from −67 dB to −80 dB (Throughout) ............ 2
Changes to TPC 14 and TPC 15 ...................................................... 8
8/12—Rev. 0 to Rev. A
Updated Outline Dimensions ........................................................ 11
Changes to Ordering Guide ........................................................... 11
Added Automotive Products Section ........................................... 11
7/01—Revision 0: Initial Version
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
©2001–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02381-0-9/15(C)
