© 2007 Microchip Technology Inc. DS21615C-page 11
TCM811/TCM812
APPENDIX A: REVISION HISTORY
Revision C (February 2007)
• Section 5.0 “Packaging Information”:
Corrected SOT-143 packaging information.
• Section 3.0 “Pin Descriptions”: Added pin
descriptions.
• Added disclaimer on package outline drawing.
• Updated package outline drawing.
• Section 1.0 “Electrical Characteristics”: Refor-
matted Electrical Characteristics
Revision B (January 2002)
• Undocumented changes.
Revision A (October 2001)
• Original Release of this Document.
