© 2007 Microchip Technology Inc. DS21615C-page 7
TCM811/TCM812
4.0 APPLICATIONS INFORMATION
The TCM811/TCM812 provides accurate V
DD
monitoring and reset timing during power-up, power-
down, and brownout/sag conditions. These devices
also reject negative-going transients (glitches) on the
power supply line. Figure 4-1 shows the maximum
transient duration vs. maximum negative excursion
(overdrive) for glitch rejection. Any combination of
duration and overdrive that is under the curve will not
generate a reset signal. Combinations above the curve
are detected as a brownout or power-down. Transient
immunity can be improved by adding a 0.1 µF capacitor
in close proximity to the V
DD
pin of the TCM811/
TCM812.
FIGURE 4-1: Maximum Transient Duration
vs. Overdrive for Glitch Rejection at +25°C.
4.1 RESET Signal Integrity During
Power-Down
The TCM811 RESET push-pull output is valid to
V
DD
= 1.0V. Below this voltage the output becomes an
"open circuit" and does not sink current. This means
CMOS logic inputs to the microcontroller will be floating
at an undetermined voltage. Most digital systems are
completely shutdown well above this voltage. How-
ever, in situations where RESET
must be maintained
valid to V
DD
= 0V, a pull-down resistor must be con-
nected from RESET
to ground to discharge stray
capacitances and hold the output low (Figure 4-2). This
resistor value, though not critical, should be chosen
such that it does not appreciably load RESET
under
normal operation (100 kΩ will be suitable for most
applications). Similarly, a pull-up resistor to V
DD
is
required for the TCM812 to ensure a valid high RESET
for V
DD
below 1.1V.
FIGURE 4-2: The addition of R
1
at the
RESET
output of the TCM811 ensures that the
RESET
output is valid to V
DD
= 0V.
4.2 Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional reset pins.
Depending on the current drive capability of the
controller pin, an indeterminate logic level may result if
there is a logic conflict. This can be avoided by adding
a 4.7 kΩ resistor in series with the output of the
TCM811/TCM812 (Figure 4-3). If there are other
components in the system which require a reset signal,
they should be buffered so as not to load the reset line.
If the other components are required to follow the reset
I/O of the microcontroller, the buffer should be
connected as shown with the solid line.
FIGURE 4-3: Interfacing the TCM811 to a
Bidirectional Reset I/O.
RESET COMPARATOR OVERDRIVE,
V
TH
- V
DD
(mV)
400
240
160
320
80
0
1
10
100
1000
MAXIMUM TRANSIENT DURATION (µsec)
T
A
= +25˚C
V
TH
Duration
Overdrive =
V
D D
V
DD
TCM81xL/M
TCM81xR/S/T
TCM811
V
DD
V
DD
R
1
100 kΩ
RESET
GND
4
2
0.1µF
1
TCM811
V
DD
RESET
GND
RESET
GND
Buffered RESET
To Other System
Components
BUFFER
Micro
4.7 kΩ
controller
0.1µF
4
2
1
TCM811/TCM812
DS21615C-page 8 © 2007 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
5.2 Taping Form
1 234
Part Number (V)
TCM811
Code
TCM811LERCTR 4.63 U1
TCM811MERCTR 4.38 U2
TCM811TERCTR 3.08 U3
TCM811SERCTR 2.93 U4
TCM811RERCTR 2.63 U5
TCM811FERCTR 1.75 U7
Part Number (V)
TCM812
Code
TCM812LERCTR 4.63 V1
TCM812MERCTR 4.38 V2
TCM812TERCTR 3.08 V3
TCM812SERCTR 2.93 V4
TCM812RERCTR 2.63 V5
TCM812FERCTR 1.75 V7
Note: In the event the full Microchip part number
cannot be marked on one line, it will be
carried over to the next line thus limiting
the number of available characters for
customer specific information.
1
& = part number code + reset threshold voltage
2
(two-digit code)
3
represents year and two-month period code
4
represents production lot ID code
P, Pitch
W, Width
of Carrier
Tape
User Direction of Feed
Pin 1
Standard Reel Component Orientation
Reverse Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
4-Pin SOT-143 8 mm 4 mm 3000 7 in.
© 2007 Microchip Technology Inc. DS21615C-page 9
TCM811/TCM812
4-Lead Plastic Small Outline Transistor (RC) [SOT-143]
Notes:
1. § Significant Characteristic.
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 4
Pitch e 1.92 BSC
Pin1 Offset e1 0.20 BSC
Overall Height A 0.80 1.22
Molded Package Thickness A2 0.75 0.90 1.07
Standoff § A1 0.01 0.15
Overall Width E 2.10 2.64
Molded Package Width E1 1.20 1.30 1.40
Overall Length D 2.67 2.90 3.05
Foot Length L 0.13 0.50 0.60
Footprint L1 0.54 REF
Foot Angle φ 8°
Lead Thickness c 0.08 0.20
Lead 1 Width b1 0.76 0.94
Leads 2, 3 & 4 Width b 0.30 0.54
D
e
e/2
N
E
E1
21
e1
A
A1
b2
A2
3X
b
c
L
L1
φ
Microchip Technology Drawing C04-031B

TCM812LERCTR

Mfr. #:
Manufacturer:
Description:
IC RESET MONITOR 4.63V SOT143-4
Lifecycle:
New from this manufacturer.
Delivery:
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