Vishay Siliconix
SiR880DP
New Product
Document Number: 65702
S10-2683-Rev. B, 22-Nov-10
www.vishay.com
1
N-Channel 80 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
100 % R
g
Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Fixed Telecom
POL
DC/DC Converter
Primary Side Switch
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()
I
D
(A)
a
Q
g
(Typ.)
80
0.0059 at V
GS
= 10 V
60
23 nC
0.0067 at V
GS
= 7.5 V
60
0.0085 at V
GS
= 4.5 V
60
Ordering Information: SiR880DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK
®
SO-8
Bottom View
N-Channel MOSFET
G
D
S
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257
). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 54 °C/W.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
80
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
60
a
A
T
C
= 70 °C
60
a
T
A
= 25 °C
23
b, c
T
A
= 70 °C
18.4
b, c
Pulsed Drain Current
I
DM
100
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
60
a
T
A
= 25 °C
5.6
b, c
Single Pulse Avalanche Current
L =0.1 mH
I
AS
35
Single Pulse Avalanche Energy
E
AS
61
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
104
W
T
C
= 70 °C
66.6
T
A
= 25 °C
6.25
b, c
T
A
= 70 °C
4.0
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 10 s
R
thJA
15 20
°C/W
Maximum Junction-to-Case (Drain)
Steady State
R
thJC
0.9 1.2
www.vishay.com
2
Document Number: 65702
S10-2683-Rev. B, 22-Nov-10
Vishay Siliconix
SiR880DP
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
80 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
36
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
- 5.8
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.2 2.8 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 80 V, V
GS
= 0 V
1
µA
V
DS
= 80 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 20 A
0.0049 0.0059
V
GS
= 7.5 V, I
D
= 20 A
0.0054 0.0067
V
GS
= 4.5 V, I
D
= 15 A
0.0070 0.0085
Forward Transconductance
a
g
fs
V
DS
= 10 V, I
D
= 20 A
64 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 40 V, V
GS
= 0 V, f = 1 MHz
2440
pFOutput Capacitance
C
oss
1525
Reverse Transfer Capacitance
C
rss
100
Total Gate Charge
Q
g
V
DS
= 40 V, V
GS
= 10 V, I
D
= 20 A
49 74
nC
V
DS
= 40 V, V
GS
= 7.5 V, I
D
= 20 A
37.2 56
V
DS
= 40 V, V
GS
= 4.5 V, I
D
= 20 A
23 35
Gate-Source Charge
Q
gs
7.6
Gate-Drain Charge
Q
gd
9.2
Gate Resistance
R
g
f = 1 MHz 0.4 2.1 4.2
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 40 V, R
L
= 2
I
D
20 A, V
GEN
= 10 V, R
g
= 1
12 24
ns
Rise Time
t
r
10 20
Turn-Off Delay Time
t
d(off)
38 70
Fall Time
t
f
11 22
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 40 V, R
L
= 2
I
D
20 A, V
GEN
= 7.5 V, R
g
= 1
15 30
Rise Time
t
r
15 30
Turn-Off Delay Time
t
d(off)
37 70
Fall Time
t
f
918
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
60
A
Pulse Diode Forward Current
a
I
SM
100
Body Diode Voltage
V
SD
I
S
= 5 A
0.75 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 20 A, dI/dt = 100 A/µs, T
J
= 25 °C
56 100 ns
Body Diode Reverse Recovery Charge
Q
rr
66 120 nC
Reverse Recovery Fall Time
t
a
23
ns
Reverse Recovery Rise Time
t
b
33
Document Number: 65702
S10-2683-Rev. B, 22-Nov-10
www.vishay.com
3
Vishay Siliconix
SiR880DP
New Product
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0 2.5
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
V
GS
= 10 V thru 5 V
V
GS
= 3 V
V
GS
= 4 V
0.004
0.005
0.006
0.007
0.008
0.009
0.010
0 20406080 100
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
= 4.5 V
V
GS
= 10 V
V
GS
= 7.5 V
0
2
4
6
8
10
0 1122334455
I
D
= 20 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 60 V
V
DS
= 20 V
V
DS
= 40 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
012345
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
C
rss
0
900
1800
2700
3600
4500
0 163248 64 80
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.6
0.9
1.2
1.5
1.8
2.1
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
R
DS(on)
- On-Resistance
V
GS
= 4.5 V
I
D
= 20 A
V
GS
= 10 V

SIR880DP-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 80V Vds 20V Vgs PowerPAK SO-8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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