NCP781
www.onsemi.com
14
PACKAGE DIMENSIONS
DFN6 3.3x3.3, 0.65P
CASE 506DF
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30MM FROM THE TERMINAL TIP..
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL A ALTERNATE CONSTRUCTION A−2
AND DETAIL B ALTERNATE CONSTRUCTION
B−2 ARE NOT APPLICABLE.
A B
E
D
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
NOTE 4
A
A3
0.08 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
DIM MIN MAX
MILLIMETERS
A 0.80 0.90
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 3.30 BSC
D2 2.55 2.75
E 3.30 BSC
E2 1.00 1.20
e 0.65 BSC
L 0.35 0.45
L1 0.00 0.15
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
ALTERNATE A−1 ALTERNATE A−2
ALTERNATE B−1 ALTERNATE B−2
E3
L2 0.20 REF
DETAIL B
1.21
3.60
1.92
0.58
6X
0.40
0.65
PITCH
3.50
1
6X
DIMENSIONS: MILLIMETERS
PACKAGE
OUTLINE
RECOMMENDED
D2
E2
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L
6X
NOTE 3
L22X
12
36
e/2
DETAIL A
3x e
0.10 BAC
E3
0.50 BSC
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