NHP620MFD, NRVHP620MFD
http://onsemi.com
5
PACKAGE DIMENSIONS
DFN8 5x6, 1.27P Dual Flag (SO8FL−Dual)
CASE 506BT
ISSUE E
M 3.25
h −−−
3.50
−−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL
AS THE TERMINALS.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED
AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
7. A VISUAL INDICATOR FOR PIN 1 MUST BE LOCATED IN THIS AREA.
1234
56
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D1
E1
h
D
E
B
A
0.20
C
0.20 C
2X
2X
DIM MIN
MILLIMETERS
A 0.90
A1 −−−
b 0.33
c 0.20
D 5.15 BSC
D1 4.70
D2 3.90
E 6.15 BSC
E1 5.70
E2 3.90
e 1.27 BSC
G 0.45
K 0.51
L 0.48
A
0.10 C
0.10 C
14
8
e
8X
D2
b1
E2
b
A0.10 B
C
0.05
C
L
DETAIL A
A1
c
4X
5
MAX
−−−
−−−
0.42
−−−
4.90
4.10
5.90
4.15
0.55
−−−
0.61
M
N 1.80 2.00
78
N
PIN ONE
IDENTIFIER
NOTE 7
NOTE 4
C
SEATING
PLANE
DETAIL A
NOTE 6
4X
K
NOTE 3
D3 1.50 1.70
b1 0.33 0.42
4X
D3
G
4X
DETAIL B
DETAIL B
ALTERNATE
CONSTRUCTION
K1 0.56 −−−
K1
3.75
12
_
MAX
1.10
0.05
0.51
0.33
5.10
4.30
6.10
4.40
0.65
−−−
0.71
2.20
1.90
0.51
−−−
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.27
0.75
1.40
3.70
4.56
8X
PITCH
6.59
4.84
1.00
DIMENSION: MILLIMETERS
2.30
4X
0.70
5.55
4X
0.56
2X
2.08
2X
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