MAX8557ETE+T

MAX8556/MAX8557
4A Ultra-Low-Input-Voltage
LDO Regulators
_______________________________________________________________________________________ 7
Detailed Description
The MAX8556/MAX8557 low-dropout linear regulators
are capable of delivering up to 4A from low-input volt-
age supplies ranging from 1.425V to 3.6V with only
200mV of dropout (max). The pMOS output stage can
be driven from input voltages down to 1.425V without
sacrificing stability or transient performance. Supply
current is not a significant function of load or input head-
room because this regulator has a pMOS output device.
The MAX8556/MAX8557 are fully protected from an out-
put short circuit by current-limiting and thermal-overload
circuitry. The low-power shutdown mode reduces sup-
ply current to 0.2µA (typ) to maximize battery life in
portable applications. The MAX8556 includes an open-
drain power-OK signal (POK) that goes high when the
regulator output is within ±10% of its nominal output
voltage. The MAX8557 includes an open-drain power-
on-reset output (POR) that goes high 140ms after the
output has risen above 90% of its nominal value.
Internal p-Channel Pass Transistor
The MAX8556/MAX8557 feature a 25m p-channel
MOSFET pass transistor. Unlike similar designs using
pnp pass transistors, p-channel MOSFETs require no
base drive, which reduces quiescent current; pnp-
based regulators also waste considerable current in
dropout when the pass transistor saturates, and use
high base-drive currents under large loads. The
MAX8556/MAX8557 do not suffer from these problems
and consume only 800µA (typ) of quiescent current
under heavy loads, as well as in dropout.
Short-Circuit/Thermal Fault Protection
The MAX8556/MAX8557 are fully protected from output
short circuits through current-limiting and thermal-over-
load circuitry. When the output is shorted to ground, the
output current is foldback limited to 3A (max). Under
these conditions, the device quickly heats up. When
the junction temperature reaches +160°C, the thermal-
overload circuitry turns off the output, allowing the
device to cool. When the junction cools to +115°C, the
output turns back on and attempts to establish regula-
tion. Current limiting and thermal protection continue
until the fault is removed.
Shutdown Mode
The MAX8556/MAX8557 feature a low-power shutdown
mode that reduces quiescent current to 0.2µA (typ).
Drive EN low to disable the voltage reference, error
amplifier, gate-drive circuitry, and pass transistor, and
pull the output low with 5k impedance. Drive EN high
or connect to IN for normal operation.
Power-OK Output (POK, MAX8556 Only)
The MAX8556 features a power-OK (POK) output to
indicate the status of the output. POK is high impedance
when the regulator output is within ±10% of its nominal
output voltage. If the output voltage falls/rises outside
this range or the IC experiences thermal fault, POK is
internally pulled low. This open-drain output requires an
external pullup resistor to V
IN
or another logic supply
below 3.6V. For glitch immunity, an internal delay circuit
prevents the output from switching for 50µs (typ) after
the trip threshold is initially reached. POK is low when
the IC is in shutdown mode.
Power-On Reset (POR, MAX8557 Only)
The MAX8557 features a power-on reset output that
goes high impedance 140ms (typ) after the output
reaches 90% of its nominal value. This open-drain out-
put requires an external pullup resistor to V
IN
or another
logic supply less than 3.6V. When the output falls below
90% of the nominal output voltage or the IC experi-
ences a thermal fault, POR immediately transitions low.
POR is low when the IC is in shutdown mode.
Operating Region and Power Dissipation
The maximum power dissipation depends on the ther-
mal resistance of the IC package and the circuit board,
the temperature difference between the die junction and
ambient air, and the rate of ambient airflow. The power
dissipated by the IC is P = I
OUT
x (V
IN
- V
OUT
). Proper
PCB layout can increase the allowed power dissipation
by dissipating heat in the board instead of the package.
See the
Thermal Considerations in PCB Layout
section
for more details.
MAX8556/MAX8557
4A Ultra-Low-Input-Voltage
LDO Regulators
8 _______________________________________________________________________________________
Applications Information
Output Voltage Selection
The MAX8556/MAX8557 feature an adjustable output
voltage from 0.5V to 3.4V. Set the output voltage using
an external resistor-divider from the output to GND with
FB connected to the center tap as shown in Figures 1
and 2. Choose R3 1k for light-load stability.
Determine R2 using the following equation:
where V
OUT
is the desired output voltage and V
FB
is 0.5V.
Capacitor Selection and
Regulator Stability
Capacitors are required at the MAX8556/MAX8557
inputs and outputs for stable operation over the full
temperature range and with load currents up to 4A.
Connect 2 x 10µF capacitors between IN and GND and
2 x 10µF low equivalent-series-resistance (ESR) capac-
itors between OUT and GND. The input capacitor (C
IN
)
lowers the source impedance of the input supply. If the
MAX8556/MAX8557s’ input is close to the output of the
source supply, a smaller input capacitance can be
used. Otherwise, 2 x 10µF ceramic input capacitors are
recommended. The output capacitor’s (C
OUT
) ESR
affects output noise and may affect output stability. Use
output capacitors with an ESR of 0.05 or less to
ensure stability and optimum transient dropout. For
good output transient performance, use the following
formula to select a minimum output capacitance:
C
OUT
= I
OUT(MAX)
x 1µF/200mA
Noise, PSRR, and Transient Response
The MAX8556/MAX8557 are designed to operate with
low-dropout voltages and low quiescent currents while
still maintaining low noise, good transient response,
and high AC rejection (see the
Typical Operating
Characteristics
for a plot of Power-Supply Rejection
Ratio (PSRR) vs. Frequency). When operating from
noisy sources, improved supply-noise rejection and
transient response can be achieved by increasing the
values of the input and output bypass capacitors and
through passive filtering techniques. The MAX8556/
MAX8557 load-transient response graphs (see the
Typical Operating Characteristics
) show two compo-
nents of the output response: a DC shift from the output
impedance due to the load current change, and the
transient response. A typical transient overshoot for a
step change in the load current from 40mA to 4A is
40mV. Use an output capacitance from 20µF to 120µF
to attenuate the overshoot.
RRx
V
V
OUT
FB
23 1 =−
IN
7–11
13
14
15
POR
POR
GND
SHUTDOWN
OUT
FB
1–6
12
R1
100k
R2
2k
R3
1k
C1
2 x 10µF
C2
2 x 10µF
18
N.C.
U2
EN
ENABLED
V
IN
1.7V TO 3.6V
V
OUT
1.5V AT 4A
MAX8557
Figure 2. MAX8557 Typical Application Circuit
IN
7–11
13
14
15
POK
POK
GND
SHUTDOWN
OUT
FB
1–6
12
R1
100k
R2
1.4k
R3
1k
C1
2 x 10µF
C2
2 x 10µF
18
N.C.
U1
EN
ENABLED
V
IN
1.425V TO 3.6V
V
OUT
1.2V AT 4A
MAX8556
Figure 1. MAX8556 Typical Application Circuit
MAX8556/MAX8557
4A Ultra-Low-Input-Voltage
LDO Regulators
_______________________________________________________________________________________ 9
Thermal Considerations
in PCB Layout
How much power the package can dissipate strongly
depends on the mounting method of the IC to the PCB
and the copper area for cooling. Using the JEDEC test
standard, the maximum power dissipation allowed in
the package is 2667mW. This data is obtained with
+70°C ambient temperature and +150°C maximum
junction temperature. The test board has dimensions of
3in x 3in with four layers of 2oz copper and FR-4 mater-
ial with 62mil finished thickness. Nine thermal vias are
used under the thermal paddle with a diameter of 12mil
and 1mil plated copper thickness. Top and bottom lay-
ers are used to route the traces. Two middle layers are
solid copper and isolated from the nine thermal vias.
More power dissipation can be handled by the pack-
age if great attention is given during PCB layout. For
example, using the top and bottom copper as a
heatsink and connecting the thermal vias to one of the
middle layers (GND) transfers the heat from the pack-
age into the board more efficiently, resulting in lower
junction temperature at high power dissipation in some
MAX8556/MAX8557 applications. Furthermore, the sol-
der mask around the IC area on both top and bottom
layers can be removed to radiate the heat directly into
the air. The maximum allowable power dissipation in
the IC is as follows:
where T
J(MAX)
is the maximum junction temperature
(+150°C), T
A
is the ambient air temperature, θ
JC
(1.7°C/W for the 16-pin TQFN) is the thermal resistance
from the junction to the case, and θ
CA
is the thermal
resistance from the case to the surrounding air through
the PCB, copper traces, and the package materials.
θ
CA
is directly related to system level variables and can
be modified to increase the maximum power dissipa-
tion. The TQFN package has an exposed thermal pad
on its underside. This pad provides a low thermal resis-
tance path for heat transfer into the PCB. This low ther-
mally resistive path carries a majority of the heat away
from the IC. The PCB is effectively a heatsink for the IC.
The exposed paddle should be connected to a large
ground plane for proper thermal and electrical perfor-
mance. The minimum size of the ground plane is
dependent upon many system variables. To create an
efficient path, the exposed paddle should be soldered
to a thermal landing, which is connected to the ground
plane by thermal vias. The thermal landing should be at
least as large as the exposed paddle and can be made
larger depending on the amount of free space from the
exposed paddle to the other pin landings.
A sample layout is available on the MAX8556 evalua-
tion kit to speed designs.
P
TT
MAX
J MAX A
JC CA
(
()
)
=
+θθ
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
16 TQFN-EP T1655+2
21-0140
Chip Information
TRANSISTOR COUNT: 3137
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.

MAX8557ETE+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
LDO Voltage Regulators 4A Ultra-Low-Input-V LDO Regulator
Lifecycle:
New from this manufacturer.
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