PMD4001K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 4 of 15
NXP Semiconductors
PMD4001K
MOSFET driver
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 1 cm
2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves
006aaa859
T
amb
(°C)
−75 17512525 75−25
200
300
100
400
500
P
tot
(mW)
0
(1)
(2)
(3)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
NPN transistor
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 540 K/W
[2]
- - 415 K/W
[3]
- - 330 K/W