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MC33363BDWR2G

P1-P3P4-P6P7-P9P10-P11
MC33363B
www.onsemi.com
4
7.0
1.0 M
f
OSC
, OSCILLATOR FREQUENCY (Hz)
Figure 2. Oscillator Frequency
versus Timing Resistor
R
T
, TIMING RESISTOR (kW)
Figure 3. Power Switch Peak Drain Current
versus Timing Resistor
500 k
200 k
100 k
50 k
20 k
10 k
10 15 20 30 50
V
CC
= 20 V
T
A
= 25°C
C
T
= 100 pF
C
T
= 200 pF
C
T
= 500 pF
C
T
= 1.0 nF
C
T
= 2.0 nF
C
T
= 5.0 nF
C
T
= 10 nF
70
V
CC
= 20 V
C
T
= 1.0 mF
T
A
= 25°C
Inductor supply voltage and inductance value are
adjusted so that I
pk
turn-off is achieved at 5.0 ms.
R
T
, TIMING RESISTOR (kW)
0.1
I
PK
, POWER SWITCH PEAK DRAIN CURRENT (A)
0.8
0.6
0.4
0.2
0.15
7.0 10 15 20 30 40 7050
0.3
1.0
0
0
1.0
70
10
100
7.0
0.8
V
sat
, OUTPUT SATURATION VOLTAGE (V)
I
O
, OUTPUT LOAD CURRENT (mA)
D
max
, MAXIMUM OUTPUT DUTY CYCLE (%)
TIMING RESISTOR RATIO
A
VOL
, OPEN LOOP VOLTAGE GAIN (dB)
f, FREQUENCY (Hz)
I
chg
, OSCILLATOR
Figure 4. Oscillator Charge/Discharge
Current versus Timing Resistor
R
T
, TIMING RESISTOR (kW)
Figure 5. Maximum Output Duty Cycle
versus Timing Resistor Ratio
Figure 6. Error Amp Open Loop Gain and
Phase versus Frequency
Figure 7. Error Amp Output Saturation
Voltage versus Load Current
/I
dscg
CHARGE/DISCHARGE CURRENT (mA)
θ, EXCESS PHASE (DEGREES)
0.5
0.3
0.2
0.15
0.1
0.08
80
60
40
20
0
-20
60
50
40
30
-1.0
-2.0
2.0
1.0
0
10 15 20 30 70 2.0 3.0 5.0 7.0 1
0
100 1.0 k 10 k 100 k 1.0 M 10 M 0.2 0.4 0.6 0.8 1.0
0
30
60
90
120
150
180
R
D
/R
T
Ratio
Discharge Resistor
Pin 7 to GND
V
CC
= 20 V
C
T
= 2.0 nF
T
A
= 25°C
R
C
/R
T
Ratio
Charge Resistor
Pin 7 to V
reg
V
CC
= 20 V
V
O
= 1.0 to 4.0 V
R
L
= 5.0 MW
C
L
= 2.0 pF
T
A
= 25°C
Gain
Phase
V
CC
= 20 V
T
A
= 25°C
Source Saturation
(Load to Ground)
Sink Saturation
(Load to V
ref
)
V
CC
= 20 V
T
A
= 25°C
GND
V
ref
50
MC33363B
www.onsemi.com
5
1.80 V
0.5 V/DIV
1.0 ms/DIV
20 mV/DIV
1.0 ms/DIV
V
CC
= 20 V
A
V
= -1.0
C
L
= 10 pF
T
A
= 25°C
Figure 8. Error Amplifier Small Signal
Transient Response
Figure 9. Error Amplifier Large Signal
Transient Response
V
CC
= 20 V
A
V
= -1.0
C
L
= 10 pF
T
A
= 25°C
1.75 V
1.70 V
3.00 V
1.75 V
0.50 V
1.0
160
0
6
-50
32
0
0
C
OSS
, DRAIN-SOURCE CAPACITANCE (pF)
V
DS
, DRAIN-SOURCE VOLTAGE (V)
V
CC
= 20 V
T
A
= 25°C
I
pk
, PEAK STARTUP CURRENT (mA)
V
CC
, POWER SUPPLY VOLTAGE (V)
R
DS(on)
, DRAIN-SOURCE ON-RESISTANCE ( )Ω
T
A
, AMBIENT TEMPERATURE (°C)
I
D
= 200 mA
V
reg
, REGULATOR VOLTAGE CHANGE (mV)
Figure 10. Regulator Output Voltage
Change versus Source Current
I
reg
, REGULATOR SOURCE CURRENT (mA)
Figure 11. Peak Startup Current
versus Power Supply Voltage
V
CC
= 20 V
R
T
= 10 k
C
Pin
8
= 1.0 mF
T
A
= 25°C
Figure 12. Power Switch Drain−Source
On−Resistance versus Temperature
Figure 13. Power Switch
Drain−Source Capacitance versus Voltage
Δ
Pulse tested at 5.0 ms with < 1.0% duty cycle
so that T
J
is as close to T
A
as possible.
C
OSS
measured at 1.0 MHz with 50 mVpp.
-20
-40
-60
-80
24
16
8.0
0
3
0
120
40
80
0
4.0 8.0 12 16 20 2.0 4.0 6.0 8.0 10 12
-25 0 25 50 75 150100 10 100 1000125
5
2
4
1
V
Pin
1
= 50 V
T
A
= 25°C
MC33363B
www.onsemi.com
6
0
I
CC
, SUPPLY CURRENT (mA)
V
CC
, SUPPLY VOLTAGE (V)
Figure 14. Supply Current versus Supply Voltage
R
T
= 10 k
Pin 1 = Open
Pin 4, 5, 10, 11,
12, 13 = GND
T
A
= 25°C
2.4
1.6
0.8
0
10 20 30 40
0.01
100
R
JA
, THERMAL RESISTANCE
t, TIME (s)
Figure 15. DW and P Suffix Transient
Thermal Resistance
θ
JUNCTION-TO-AIR ( C/W)°
0.1 1.0 10 100
10
1.0
L = 12.7 mm of 2.0 oz.
copper. Refer to Figures
16 and 17.
3.2
C
T
= 2.0 nF
C
T
= 390 pF
0
100
R
JA
, THERMAL RESISTANCE
L, LENGTH OF COPPER (mm)
P
D(max)
for T
A
= 50°C
Figure 16. DW Suffix (SOP−16L) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
θ
JUNCTION-TO-AIR ( C/W)°
P
D
, MAXIMUM POWER DISSIPATION (W)
R
q
JA
90
70
60
80
50
10 20 30 40 50
2.8
2.4
1.6
1.2
2.0
0.8
0.4
0
40
30
0
0
Figure 17. P Suffix (DIP−16) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
Graphs represent symmetrical layout
3.0 mm
Printed circuit board heatsink example
L
L
100
80
60
40
20
10 20 30 40 50
L, LENGTH OF COPPER (mm)
P
D
, MAXIMUM POWER DISSIPATION (W)
5.0
4.0
3.0
2.0
1.0
0
P
D(max)
for T
A
= 70°C
2.0 oz
Copper
R
q
JA
R , THERMAL RESISTANCE
JAθ
JUNCTION-TO-AIR ( C/W)°
Graphs represent symmetrical layout
3.0 mm
L
L
2.0 oz
Copper
Printed circuit board heatsink example
P1-P3P4-P6P7-P9P10-P11

MC33363BDWR2G

Mfr. #:
Buy MC33363BDWR2G
Manufacturer:
ON Semiconductor
Description:
AC/DC Converters 700V 1.5A Switching w/OVP
Lifecycle:
New from this manufacturer.
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