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HMC787ALC3B

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
Data Sheet HMC787A
Rev. A | Page 3 of 17
SPECIFICATIONS
T
A
= 25°C, IF = 100 MHz, LO = 17 dBm, and all measurements performed as downconverter, unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit
FREQUENCY RANGE
RF 3 10 GHz
LO 3 10 GHz
IF DC 4 GHz
LO DRIVE LEVEL 17 dBm
PERFORMANCE AT RF = 3 GHz to 9 GHz
Conversion Loss 9 11 dB
Single Sideband (SSB) Noise Figure 9 dB
Input Third-Order Intercept (IP3) 15 24 dBm
Input 1 dB Compression Point (P1dB) 17 dBm
Input Second-Order Intercept (IP2) 67 dB
RF to IF Isolation 15 26 dB
LO to RF Isolation
48
dB
LO to IF Isolation 35 43 dB
PERFORMANCE AT RF = 9 GHz to 10 GHz
Conversion Loss 9 11 dB
SSB Noise Figure 9 dB
Input IP3 15 24 dBm
Input P1dB 15 dBm
Input IP2 66 dB
RF to IF Isolation 15 26 dB
LO to RF Isolation 47 dB
LO to IF Isolation 25 42 dB
HMC787A Data Sheet
Rev. A | Page 4 of 17
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 28 dBm
LO Input Power 28 dBm
IF Input Power 28 dBm
IF Source and Sink Current 12 mA
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 11.6 mW/°C Above 85°C)
1044 mW
Maximum Junction Temperature
175°C
Maximum Peak Reflow Temperature (MSL3)
1
260°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 1500 V (Class 1C)
Field Induced Charged Device Model
(FICDM)
1000 V (Class C5)
1
See the Ordering Guide section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
E-12-1
1
120 86 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Data Sheet HMC787A
Rev. A | Page 5 of 17
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
9
8
1
3 7
2
5
4
6
12
11
10
GND
LO
GND
NIC
NIC
NIC
GND
RF
GND
GND
GND
IF
GND
PACKAGE
BASE
13608-002
HMC787A
TOP VIEW
(Not to Scale)
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
2. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic.
2
LO
Local Oscillator. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
5 IF Intermediate Frequency. This pin is dc-coupled. For applications not requiring operation to dc, externally
block this pin using a series capacitor whose value is chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 12 mA of current or device nonfunction and
possible device failure results. See for Figure 5 the IF interface schematic.
8 RF Radio Frequency. This pin is dc-coupled and matched to 50 Ω. See Figure 6 for the RF interface schematic.
10 to 12 NIC Not Internally Connected.
EPAD Exposed Pad. Exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
13608-003
Figure 3. GND Interface Schematic
LO
13608-004
Figure 4. LO Interface Schematic
IF
13608-005
Figure 5. IF Interface Schematic
RF
13608-006
Figure 6. RF Interface Schematic
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

HMC787ALC3B

Mfr. #:
Buy HMC787ALC3B
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Double-Balanced - Mixer, 3-11GHz
Lifecycle:
New from this manufacturer.
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