CS3004
8 DS719F1
4. ORDERING INFORMATION
5. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
6. REVISION HISTORY
Part # Temperature Range Package Description
CS3004-FS -40 °C to +125 °C 8-lead SOIC
CS3004-FSZ -40 °C to +125 °C 8-lead SOIC, Lead Free
CS3004-FNZ* -40 °C to +125 °C 8-lead QFN, Lead Free
* Connect thermal die pad to V-.
Model Number Peak Reflow Temp MSL Rating* Max Floor Life
CS3004-FS 240 °C
2365 DaysCS3004-FSZ
260 °C
CS3004-FNZ
Revision Date Changes
PP4 FEB 2007 First public release.
F1 AUG 2007 Updated to “Final” per QPL process.
