NCV8772
http://onsemi.com
3
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage (Note 1) DC
Transient, t < 100 ms
V
in
−0.3
−
40
45
V
Input Current I
in
−5 − mA
Output Voltage (Note 2) V
out
−0.3 5.5 V
Output Current I
out
−3 Current Limited mA
Enable Input Voltage DC
Transient, t < 100 ms
V
EN
−0.3
−
40
45
V
Enable Input Current I
EN
−1 1 mA
DT (Reset Delay Time Select) Voltage V
DT
−0.3 5.5 V
DT (Reset Delay Time Select) Current I
DT
−1 1 mA
Reset Output Voltage V
RO
−0.3 5.5 V
Reset Output Current I
RO
−3 3 mA
Junction Temperature T
J
−40 150 °C
Storage Temperature T
STG
−55 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (V
in
+ 0.3 V) (whichever is lower).
ESD CAPABILITY (Note 3)
Rating
Symbol Min Max Unit
ESD Capability, Human Body Model ESD
HBM
−2 2 kV
ESD Capability, Machine Model ESD
MM
−200 200 V
ESD Capability, Charged Device Model ESD
CDM
−1 1 kV
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol Min Max Unit
Moisture Sensitivity Level DPAK−5
D2PAK−5
D2PAK−7
MSL 1
1
3
−
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
T
SLD
− 265 peak
°C
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS (Note 5)
Rating
Symbol Value Unit
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
R
q
JA
R
Y
JC
56
8.4
°C/W
Thermal Characteristics, D2PAK−5
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
R
q
JA
R
Y
JC
53
8.4
°C/W
Thermal Characteristics, D2PAK−7
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
R
q
JA
R
Y
JC
51
8.4
°C/W
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate.
