OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

PLB190S

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R03
PLB190
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On Resistance (:)
12
13
14
15
16
17
18
19
20
On-Resistance vs. Temperature
AC/DC Configuration
(I
F
=0mA, I
L
=75mA)
Load Voltage (V)
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0
Load Current (A)
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
0.08
0.09
0.10
0.11
0.12
0.13
0.14
Maximum Load Current
vs. Temperature - AC/DC Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
On-Resistance vs. Temperature
DC-Only Configuration
(I
F
=0mA, I
L
=100mA)
Load Voltage (V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Load Current (mA)
0.00
0.05
0.10
0.15
0.20
0.25
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
0.10
0.12
0.14
0.16
0.18
0.20
0.22
0.24
0.26
Maximum Load Current
vs. Temperature - DC Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (V
P
)
440
445
450
455
460
465
470
475
480
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
50
100
150
200
250
300
350
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(I
F
=5mA, V
L
=400V)
Load Voltage (V)
0 50 100 150 200
Output Capacitance (pF)
0
20
40
60
80
100
120
140
Output Capacitance
vs. Load Voltage
(I
F
=5mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
I
NTEGRATED
C
IRCUITS
D
IVISION
PLB190
www.ixysic.com
5
R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
PLB190 / PLB190S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
PLB190 / PLB190S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R03
PLB190
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLB190
PLB190S
Mechanical Dimensions
P1-P3P4-P6P7-P7

PLB190S

Mfr. #:
Buy PLB190S
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount Single Pole 1-Form-B 400V 130mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet