MC74VHCT374ADTRG

© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 6
1 Publication Order Number:
MC74VHCT374A/D
MC74VHCT374A
Octal D-Type Flip-Flop
with 3-State Output
The MC74VHCT374A is an advanced high speed CMOS octal
flip−flop with 3−state output fabricated with silicon gate CMOS
technology. It achieves high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining CMOS low power
dissipation.
This 8−bit D−type flip−flop is controlled by a clock input and an
output enable input. When the output enable input is high, the eight
outputs are in a high impedance state.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The VHCT inputs are compatible with TTL levels. This device can
be used as a level converter for interfacing 3.3 V to 5.0 V, because it
has full 5.0 V CMOS level output swings.
The VHCT374A input and output (when disabled) structures
provide protection when voltages between 0 V and 5.5 V are applied,
regardless of the supply voltage. These input and output structures
help prevent device destruction caused by supply
voltage−input/output voltage mismatch, battery backup, hot insertion,
etc.
Features
High Speed: f
max
= 140 MHz (Typ) at V
CC
= 5.0 V
Low Power Dissipation: I
CC
= 4 mA (Max) at T
A
= 25°C
TTL−Compatible Inputs: V
IL
= 0.8 V; V
IH
= 2.0 V
Power Down Protection Provided on Inputs and Outputs
Balanced Propagation Delays
Designed for 4.5 V to 5.5 V Operating Range
Low Noise: V
OLP
= 1.6 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
Chip Complexity: 276 FETs or 69 Equivalent Gates
These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
20
1
TSSOP−20
SUFFIX DT
CASE 948E
SOIC−20WB
SUFFIX DW
CASE 751D
VHCT
374A
ALYWG
G
1
1
20
1
VHCT374A
AWLYYWWG
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
OE CP Q
L
L
L
H
L, H,
X
H
L
No Change
Z
INPUTS OUTPUT
FUNCTION TABLE
D
H
L
X
X
MC74VHCT374A
http://onsemi.com
2
Figure 1. Logic Diagram
DATA
INPUTS
D0
D1
D2
D3
D4
D5
D6
D7
18
17
14
13
8
7
4
3
1
OE
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
16
15
12
9
6
5
2
NONINVERTING
OUTPUTS
11
CP
Figure 2. Pin Assignment
Q2
D1
D0
Q0
OE
GND
Q3
D3
D2
Q1 5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Q6
D6
D7
Q7
V
CC
CP
Q4
D4
D5
Q5
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
DC Supply Voltage – 0.5 to + 7.0 V
V
in
DC Input Voltage – 0.5 to + 7.0 V
V
out
DC Output Voltage Outputs in 3−State
High or Low State
– 0.5 to + 7.0
– 0.5 to V
CC
+ 0.5
V
I
IK
Input Diode Current − 20 mA
I
OK
Output Diode Current (V
OUT
< GND; V
OUT
> V
CC
) ± 20 mA
I
out
DC Output Current, per Pin ± 25 mA
I
CC
DC Supply Current, V
CC
and GND Pins ± 75 mA
P
D
Power Dissipation in Still Air, SOIC Package†
TSSOP Package†
500
450
mW
T
stg
Storage Temperature – 65 to + 150
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any
of these limits are exceeded, device functionality should not be assumed, damage may occur
and reliability may be affected.
Derating SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage 4.5 5.5 V
V
in
DC Input Voltage 0 5.5 V
V
out
DC Output Voltage Outputs in 3−State
High or Low State
0
0
5.5
V
CC
V
T
A
Operating Temperature − 40 + 85
_C
t
r
, t
f
Input Rise and Fall Time V
CC
=5.0V ±0.5V 0 20 ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND v (V
in
or V
out
) v V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.
MC74VHCT374A
http://onsemi.com
3
DC ELECTRICAL CHARACTERISTICS
Symbo
l
Parameter Test Conditions
V
CC
V
T
A
= 25°C T
A
= − 40 to 85°C
Uni
t
Min Typ Max Min Max
V
IH
Minimum High−Level Input Voltage 4.5 to 5.5 2.0 2.0 V
V
IL
Maximum Low−Level Input Voltage 4.5 to 5.5 0.8 0.8 V
V
OH
Minimum High−Level Output
Voltage V
in
= V
IH
or V
IL
I
OH
= − 50mA
4.5 4.4 4.5 4.4 V
I
OH
= − 8mA 4.5 3.94 3.80
V
OL
Maximum Low−Level Output
Voltage V
in
= V
IH
or V
IL
I
OL
= 50mA
4.5 0.0 0.1 0.1 V
I
OL
= 8mA 4.5 0.36 0.44
I
in
Maximum Input Leakage Current V
in
= 5.5 V or GND 0 to 5.5 ± 0.1 ± 1.0
mA
I
OZ
Maximum 3−State Leakage Current V
in
= V
IL
or V
IH
V
out
= V
CC
or GND
5.5 ± 0.25 ± 2.5
mA
I
CC
Maximum Quiescent Supply Current V
in
= V
CC
or GND 5.5 4.0 40.0
mA
I
CCT
Quiescent Supply Current Per Input: V
IN
= 3.4V
Other Input: V
CC
or GND
5.5 1.35 1.50 mA
I
OPD
Output Leakage Current V
OUT
= 5.5V 0 0.5 5.0
mA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= t
f
= 3.0ns)
Symbo
l
Parameter Test Conditions
T
A
= 25°C T
A
= − 40 to 85°C
Uni
t
Min Typ Max Min Max
f
max
Maximum Clock Frequency
(50% Duty Cycle)
V
CC
= 5.0 ± 0.5V C
L
= 15pF
C
L
= 50pF
90
85
140
130
80
95
MHz
t
PLH
,
t
PHL
Maximum Propagation Delay,
CP to Q
V
CC
= 5.0 ± 0.5V C
L
= 15pF
C
L
= 50pF
4.1
5.6
9.4
10.4
1.0
1.0
10.5
11.5
ns
t
PZL
,
t
PZH
Output Enable Time,
OE
to Q
V
CC
= 5.0 ± 0.5V C
L
= 15pF
R
L
= 1kW C
L
= 50pF
6.5
7.3
10.2
11.2
1.0
1.0
11.5
12.5
ns
t
PLZ
,
t
PHZ
Output Disable Time
OE
to Q
V
CC
= 5.0 ± 0.5V C
L
= 50pF
R
L
= 1kW
7.0 11.2 1.0 12.0 ns
t
OSLH
,
t
OSHL
Output to Output Skew V
CC
= 5.0 ± 0.5V C
L
= 50pF
(Note 1)
1.0 1.0 ns
C
in
Maximum Input Capacitance 4 10 10 pF
C
out
Maximum 3−State Output Capacitance
(Output in High−Impedance State)
9 pF
C
PD
Power Dissipation Capacitance (Note 2)
Typical @ 25°C, V
CC
= 5.0V
pF
25
1. Parameter guaranteed by design. t
OSLH
= |t
PLHm
− t
PLHn
|, t
OSHL
= |t
PHLm
− t
PHLn
|.
2. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
/8 (per flip−flop). C
PD
is used to determine the
no−load dynamic power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.
NOISE CHARACTERISTICS (Input t
r
= t
f
= 3.0ns, C
L
= 50pF, V
CC
= 5.0V)
Symbo
l
Parameter
T
A
= 25°C
Unit
Typ Max
V
OLP
Quiet Output Maximum Dynamic V
OL
1.2 1.6 V
V
OLV
Quiet Output Minimum Dynamic V
OL
−1.2 −1.6 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
TIMING REQUIREMENTS (Input t
r
= t
f
= 3.0ns)
Symbo
l
Parameter Test Conditions
T
A
= 25°C T
A
= − 40 to 85°C
Uni
t
Typ Limit Limit
t
w
Minimum Pulse Width, CP V
CC
= 5.0 ± 0.5 V 6.5 8.5 ns
t
su
Minimum Setup Time, D to CP V
CC
= 5.0 ± 0.5 V 2.5 2.5 ns
t
h
Minimum Hold Time, D to CP V
CC
= 5.0 ± 0.5 V 2.5 2.5 ns

MC74VHCT374ADTRG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Flip Flops 5V CMOS Octal D-Type w/6-State Out
Lifecycle:
New from this manufacturer.
Delivery:
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