74LV138_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 15 November 2007 13 of 17
NXP Semiconductors
74LV138
3-to-8 line decoder/demultiplexer; inverting
Fig 12. Package outline SOT403-1 (TSSOP16)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153
99-12-27
03-02-18
w M
b
p
D
Z
e
0.25
18
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index
74LV138_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 15 November 2007 14 of 17
NXP Semiconductors
74LV138
3-to-8 line decoder/demultiplexer; inverting
Fig 13. Package outline SOT763-1 (DHVQFN16)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
3.6
3.4
D
h
2.15
1.85
y
1
2.6
2.4
1.15
0.85
e
1
2.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT763-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT763-1
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
27
15
10
9
8
1
16
X
D
E
C
B
A
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
74LV138_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 15 November 2007 15 of 17
NXP Semiconductors
74LV138
3-to-8 line decoder/demultiplexer; inverting
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74LV138_3 20071115 Product data sheet - 74LV138_2
Modifications:
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 3: DHVQFN16 package added.
Section 8: derating values added for DHVQFN16 package.
Section 12: outline drawing added for DHVQFN16 package.
74LV138_2 19980428 Product specification - 74LV138_1
74LV138_1 19970203 Product specification - -

74LV138N,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 3 TO 8 LINE DECODER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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