AD8397
Rev. A | Page 13 of 16
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 25. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETER; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.050)
0.40 (0.016)
0.50 (0.020)
0.25 (0.010)
45°
8°
0°
1.75 (0.069)
1.35 (0.053)
1.65 (0.065)
1.25 (0.049)
SEATING
PLANE
85
41
5.00 (0.197)
4.90 (0.193)
4.80 (0.189)
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
1.27 (0.05)
BSC
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
0.51 (0.020)
0.31 (0.012)
COPLANARITY
0.10
TOP VIEW
3.098 (0.122)
BOTTOM VIEW
(PINS UP)
2.41 (0.095)
0.10 (0.004)
MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
07-28-2008-A
Figure 26. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]
Narrow Body
(RD-8-2)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
Temperature Package Package Description Package Outline
AD8397ARZ −40°C to +85°C 8-Lead SOIC_N R-8
AD8397ARZ-REEL −40°C to +85°C 8-Lead SOIC_N R-8
AD8397ARZ-REEL7 −40°C to +85°C 8-Lead SOIC_N R-8
AD8397ARDZ −40°C to +85°C 8-Lead SOIC_N_EP RD-8-2
AD8397ARDZ-REEL −40°C to +85°C 8-Lead SOIC_N_EP RD-8-2
AD8397ARDZ-REEL7 −40°C to +85°C 8-Lead SOIC_N_EP RD-8-2
1
Z = RoHS Compliant Part.