ATS2012UV395 Datasheet ATS2012UV395 | P1-P3

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Part Number

Emitting Color

(Material)

Lens Type

Φe(mW)

[2]

@ 20mA

Viewing

[1]

Angle

Min. Typ. 2θ1/2

ATS2012UV395 Ultraviolet (InGaN) Water Clear 150° 10 16

FEATURES

z 2.0 mm x 1.25 mm SMD LED, 0.75 mm thickness

z Low power consumption

z Wide viewing angle

z Package: 2000 pcs / reel

z Moisture sensitivity level: 1

z RoHS compliant

APPLICATIONS

z Photocatalytic Purification

z Blood and Counterfeit money detection

z UV curing in nail salon, dental, and poster printing

applications

z UV Sensor Light

PACKAGE MATERIALS

z Material as follows:

Package: Ceramics

Encapsulating resin: Silicone resin

Electrodes: Au plating

ATTENTION

Observe precautions for handling

electrostatic discharge sensitive devices

PACKAGE DIMENSIONS

SELECTION GUIDE

Notes:

1. θ1/2 is the angle from optical centerline where the radiant intensity is 1/2 of the optical peak value.

2. Radiant flux: +/-15%.

3. Radiant flux value is traceable to CIE127-2007 standards.

ATS2012UV395

2.0 x 1.25 mm UV LED With Ceramic Substrate

RECOMMENDED SOLDERING PATTERN

(units : mm; tolerance : ± 0.1)

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. The specifications, characteristics and technical data described in the datasheet are subject to

change without prior notice.

4. The device has a single mounting surface. The device must be mounted according to the specifications.

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ABSOLUTE MAXIMUM RATINGS at T

A

=25°C

ELECTRICAL / OPTICAL CHARACTERISTICS at T

A

=25°C

ATS2012UV395

Notes:

1. Forward voltage: ±0.1V.

2. Wavelength value is traceable to CIE127-2007 standards.

3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

Parameter Symbol Value Unit

Wavelength at Peak Emission I

F

= 20mA [Min.]

λ

peak

390

Wavelength at Peak Emission I

F

= 20mA [Typ.] 395

Wavelength at Peak Emission I

F

= 20mA [Max.] 400

Spectral Bandwidth at 50% Φ REL MAX I

F

= 20mA [Typ.] Δλ 13 nm

Forward Voltage I

F

= 20mA [Typ.]

V

F

[1]

3.3

V

Forward Voltage I

F

= 20mA [Max.] 3.8

Reverse Current (V

R

= 5V) [Max.] I

R

50

µA

Temperature Coefficient of V

F

I

F

= 20mA, -10°C ≤ T ≤ 85°C

TC

V

-3.0 mV/°C

nm

Parameter Symbol Value Unit

Power Dissipation P

D

120 mW

Reverse Voltage V

R

5 V

Junction Temperature T

j

115 °C

Operating Temperature T

op

-40 to +85 °C

Storage Temperature T

stg

-40 to +85 °C

DC Forward Current I

F

30 mA

Peak Forward Current I

FM

[1]

100 mA

Thermal Resistance (Junction / Ambient) R

th

JA

[2]

100 °C/W

Thermal Resistance (Junction / Solder point) R

th

JS

[2]

50 °C/W

Notes:

1. 1/10 Duty Cycle, 0.1ms Pulse Width.

2. R

th

JA

,R

th

JS

Results from mounting on PC board FR4 (pad size ≥ 16 mm

2

per pad).

3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

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0%

20%

40%

60%

80%

100%

300 315 330 345 360 375 390 405 420 435 450

T

a

= 25 °C

Wavelength (nm)

Relative radiant Intensity (a. u.)

0

10

20

30

40

50

2.7 2.9 3.1 3.3 3.5 3.7

T

a

= 25 °C

Forward voltage (V)

Forward current (mA)

0

0.5

1

1.5

2

2.5

0 1020304050

T

a

= 25 °C

Forward current (mA)

Radiant flux normalised

at 20 mA

0

10

20

30

40

50

-40 -20 0 20 40 60 80 100

Ambient temperature (°C)

Permissible forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

-40-200 20406080100

Ambient temperature (°C)

Radiant flux normalised

at T

a

= 25 °C

0.5 0.5

90°

15°

0°

30°

45°

60°

75°

-15°

-30°

-45°

-60°

-75°

-90°

0.01.0 1.0

T

a

= 25 °C

TECHNICAL DATA

RELATIVE INTENSITY vs. WAVELENGTH

ULTRAVIOLET

SPATIAL DISTRIBUTION

Forward Current vs.

Forward Voltage

Radiant Flux vs.

Forward Current

Forward Current Derating Curve

Radiant Flux vs.

Ambient Temperature

ATS2012UV395

TAPE SPECIFICATIONS (units : mm)

REEL DIMENSION (units : mm)

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

Notes:

1. Don't cause stress to the LEDs while it is exposed to high temperature.

2. The maximum number of reflow soldering passes is 2 times.

3. Reflow soldering is recommended. Other soldering methods are not recommended as they might

cause damage to the product.

ATS2012UV395

ATS2012UV395

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