10078995-G02-14ULF

© 2007 IXYS CORPORATION All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 175°C55V
V
DGR
T
J
= 25°C to 175°C; R
GS
= 1 MΩ 55 V
V
GSM
Transient ± 20 V
I
D25
T
C
= 25°C 140 A
(Combined die total = 280 A)
I
LRMS
Package Current Limit, RMS 75 A
(Combined die total = 150 A)
I
DM
T
C
= 25°C, pulse width limited by T
JM
650 A
I
AS
T
C
= 25°C25A
E
AS
T
C
= 25°C 1.0 J
dv/dt I
S
I
DM
, di/dt 100 A/μs, V
DD
V
DSS
3 V/ns
T
J
175°C, R
G
= 3.3 Ω
P
D
T
C
= 25°C 150 W
T
J
-55 ... +175 °C
T
JM
175 °C
T
stg
-55 ... +175 °C
T
L
1.6 mm (0.062 in.) from case for 10 s 300 °C
Plastic body for 10 seconds 260 °C
V
ISOL
50/60 Hz, t = 1 minute, I
ISOL
< 1 mA, RMS 2500 V
.
F
C
Mounting force 30..170 / 7..36 N/lb.
Weight Package 9 g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0 V, I
D
= 250 μA55V
V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.0 4.0 V
I
GSS
V
GS
= ± 20 V, V
DS
= 0 V ± 200 nA
I
DSS
V
DS
= V
DSS
5 μA
V
GS
= 0 V T
J
= 150°C 250 μA
R
DS(on)
V
GS
= 10 V, I
D
= 50 A, Note 1, 2 4.4mΩ
N-Channel Enhancement Mode
Avalanche Rated
IXTL2x240N055T V
DSS
=55V
I
D25
= 2x140 A
R
DS(on)
4.4 m
ΩΩ
ΩΩ
Ω
DS99721 (01/07)
G = Gate D = Drain
S = Source
ISOPLUS i5-Pak
TM
(IXTL)
Isolated back
surface
D
S
G
S
D
All ratings and parametric values are per each MOSFET die unless otherwise specified.
TrenchMV
TM
Power MOSFETs
Common-Gate Pair
(Electrically Isolated Back Surface)
DD
SG S
R
G
R
G
Features
Ultra-low On Resistance
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
175 °C Operating Temperature
Advantages
Easy to mount
Space savings
High power density
Applications
Automotive
- Motor Drives
- High Side Switch
- 12V Battery
- ABS Systems
DC/DC Converters and Off-line UPS
Primary- Side Switch
High Current Switching
Applications
Advance Technical Information
IXYS reserves the right to change limits, test conditions, and dimensions.
IXTL2x240N055T
Notes: 1. Pulse test, t 300 μs, duty cycle d 2 %;
2. Drain and source Kelvin contact must be located less than 5 mm from
the plastic body.
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified)
Min. Typ. Max.
g
fs
V
DS
= 10 V; I
D
= 60 A, Note 1 80 132 S
R
G
3 Ω
C
iss
7600 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 1240 pF
C
rss
260 pF
t
d(on)
40 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 25A 54 ns
t
d(off)
R
G
= 5 Ω (External) 63 ns
t
f
75 ns
Q
g(on)
170 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 25A 32 nC
Q
gd
48 nC
R
thJC
1.0 °C/W
R
thCS
0.25 °C/W
Source-Drain Diode Characteristic Values
T
J
= 25°C unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
I
S
V
GS
= 0 V 240 A
I
SM
Pulse width limited by T
JM
650 A
V
SD
I
F
= 50 A, V
GS
= 0 V, Note 1 1.0 V
t
rr
I
F
= 25 A, -di/dt = 100 A/μs40ns
V
R
= 30 V, V
GS
= 0 V
ISOPLUS i5-Pak
TM
(IXTL) Outline
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2
one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6771478 B2 7,071,537
Note:
1. TAB 6 - Electrically isolated from the
other pins.
2. All leads and tab are tin plated.
Leads:
1, 5: Drain
2, 4: Source
3: Gate
6. Isolated
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered
are derived from a subjective evaluation of the design, based upon prior knowledge and
experience, and constitute a "considered reflection" of the anticipated result. IXYS reserves
the right to change limits, test conditions, and dimensions without notice.

10078995-G02-14ULF

Mfr. #:
Manufacturer:
Description:
Headers & Wire Housings 14P DR SHRD VRT SMT LO PRO EJCT LTCH HDR
Lifecycle:
New from this manufacturer.
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