SI4176DY-T1-GE3

Vishay Siliconix
Si4176DY
New Product
Document Number: 65539
S09-2430-Rev. A, 16-Nov-09
www.vishay.com
1
N-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
100 % R
g
and UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch
Low Current dc-to-dc
Notebook
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
30
0.020 at V
GS
= 10 V
12
a
4.7 nC
0.027 at V
GS
= 4.5 V
10.4
N-
C
hannel M
OS
FET
G
D
S
D
S
D
D
G
D
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information:
Si4176DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
S
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 85 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
12
a
A
T
C
= 70 °C
9.7
T
A
= 25 °C
8.3
b, c
T
A
= 70 °C
6.6
b, c
Pulsed Drain Current
I
DM
40
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
4.2
T
A
= 25 °C
2
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
10
Single Pulse Avalanche Energy
E
AS
5
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
5
W
T
C
= 70 °C
3.2
T
A
= 25 °C
2.4
b, c
T
A
= 70 °C
1.5
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s R
thJA
42 53
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
19 25
www.vishay.com
2
Document Number: 65539
S09-2430-Rev. A, 16-Nov-09
Vishay Siliconix
Si4176DY
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
28
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 5.5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.2 2.2 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 8.3 A
0.016 0.020
Ω
V
GS
= 4.5 V, I
D
= 7.2 A
0.022 0.027
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 8.3 A
23 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
490
pFOutput Capacitance
C
oss
110
Reverse Transfer Capacitance
C
rss
61
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 8.3 A
9.6 15
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 8.3 A
4.7 7.1
Gate-Source Charge
Q
gs
1.65
Gate-Drain Charge
Q
gd
1.75
Gate Resistance
R
g
f = 1 MHz 0.5 2.6 5.2 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 2.2 Ω
I
D
6.7 A, V
GEN
= 4.5 V, R
g
= 1 Ω
15 25
ns
Rise Time
t
r
15 25
Turn-Off Delay Time
t
d(off)
13 20
Fall Time
t
f
10 15
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 2.2 Ω
I
D
6.7 A, V
GEN
= 10 V, R
g
= 1 Ω
10 15
Rise Time
t
r
10 15
Turn-Off Delay Time
t
d(off)
15 25
Fall Time
t
f
10 15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
4.2
A
Pulse Diode Forward Current
I
SM
40
Body Diode Voltage
V
SD
I
S
= 6.7 A, V
GS
= 0 V
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 6.7 A, dI/dt = 100 A/µs, T
J
= 25 °C
15 30 ns
Body Diode Reverse Recovery Charge
Q
rr
8 16 nC
Reverse Recovery Fall Time
t
a
8.5
ns
Reverse Recovery Rise Time
t
b
6.5
Document Number: 65539
S09-2430-Rev. A, 16-Nov-09
www.vishay.com
3
Vishay Siliconix
Si4176DY
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
8
16
24
32
40
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
GS
=10V thru 5 V
V
GS
=4V
V
GS
=3V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
0.000
0.008
0.016
0.024
0.032
0.040
010203040
V
GS
=4.5V
V
GS
=10V
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0
2
4
6
8
10
036912
V
DS
=24V
I
D
=8.3A
V
DS
=7.5V
V
DS
=15V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
4
8
12
16
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T
C
= 25 °C
T
C
= 125 °C
T
C
=- 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
0
100
200
300
400
500
600
700
0 5 10 15 20 25 30
C
iss
C
oss
C
rss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
I
D
=8.3A
V
GS
=10V;4.5V
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)

SI4176DY-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 781-SI4178DY-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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