AD8106/AD8107
Rev. A | Page 6 of 22
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage 12.0 V
Internal Power Dissipation
AD8106/AD8107 80-Lead LQFP (ST-80-1) 2.6 W
Input Voltage ±V
S
Output Short-Circuit Duration
Observe power
derating curves
θ
JA
48°C/W
Operating Temperature Range
Storage Temperature Range −65°C to +125°C
Lead Temperature (Soldering 10 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8106/AD8107 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit can cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8106/AD8107 is internally short-circuit
protected, this may not be sufficient to guarantee that the
maximum junction temperature (150°C) is not exceeded under
all conditions. To ensure proper operation, it is necessary to
observe the maximum power derating curves shown in Figure 3.
AMBIENT TEMPERATURE (°C)
5
MAXIMUM POWER DISSIPATION (W)
4
0
–50 80–40 –30 –20 –10 0 10 20 30 40 50 60 70
3
2
1
90
T
J
= 150°C
05774-003
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
