Data Sheet AD8106/AD8107
Rev. A | Page 19 of 22
First, measure the crosstalk terms associated with driving a test
signal into each of the other 15 inputs one at a time. Then measure
the crosstalk terms associated with driving a parallel test signal
into all 15 other inputs taken two at a time in all possible
combinations; and then three at a time, and so on, until finally,
there is only one way to drive a test signal into all 15 other inputs.
Each of these cases is legitimately different from the others and
could yield a unique value depending on the resolution of the
measurement system. However, it is impractical to measure all
of these terms and then to specify them. In addition, this
describes the crosstalk matrix for only one input channel. A
similar crosstalk matrix can be proposed for every other input.
If the possible combinations and permutations for connecting
inputs to the other outputs (not used for measurement) are
taken into consideration, the numbers grow rather quickly to
astronomical proportions. If a larger crosspoint array of
multiple AD8106/AD8107 devices is constructed, the numbers
grow larger still.
Obviously, some subset of all these cases must be selected to be
used as a guide for a practical measure of crosstalk. One common
method is to measure all hostile crosstalk, which means that the
crosstalk to the selected channel is measured while all other
system channels are driven in parallel. In general, this yields the
worst crosstalk number, but this is not always the case due to
the vector nature of the crosstalk signal.
Other useful crosstalk measurements are those created by one
of the nearest neighbors or by two of the nearest neighbors on
either side. These crosstalk measurements are generally higher
than those of more distant channels, so they can serve as a
worst-case measure for any other one-channel or two-channel
crosstalk measurements.
Input and Output Crosstalk
The flexible programming capability of the AD8106/AD8107
can be used to diagnose whether crosstalk is occurring more on
the input side or the output side. For example, a given input
channel, such as IN07 in the middle, can be programmed to
drive OUT01. The input to IN07 is terminated to ground (via
50 or 75 Ω) and no signal is applied.
All the other inputs are driven in parallel with the same test
signal (practically provided by a distribution amplifier) with all
other outputs disabled, except OUT01. Because grounded IN07
is programmed to drive OUT01, no signal should be present. If
any signal is present, it can be attributed to the other 15 hostile
input signals because no other outputs are driven; that is, they
are all disabled. Thus, this method measures the all-hostile input
contribution to crosstalk into IN07. This method can also be used
for other input channels and combinations of hostile inputs.
For output crosstalk measurement, a single input channel (IN00,
for example) is driven and all outputs other than a given output
are programmed to connect to IN00. OUT01 is programmed to
connect to IN15, which is far away from IN00, and is terminated
to ground. As a result, OUT01 should not have a signal present
because it is listening for a quiet input. Any signal measured at
the OUT01 can be attributed to the output crosstalk of the other
seven hostile outputs. Again, this method can be modified to
measure other channels and other crosspoint matrix
combinations.
Effect of Impedances on Crosstalk
The input side crosstalk can be influenced by the output
impedance of the sources that drive the inputs. The lower the
impedance of the drive source, the lower the magnitude of the
crosstalk. The dominant crosstalk mechanism on the input side
is capacitive coupling. The high impedance inputs do not have
significant current flow to create magnetically induced crosstalk.
However, significant current can flow through the input
termination resistors and the loops that drive them. Thus,
the printed circuit board on the input side can contribute to
magnetically coupled crosstalk.
From a circuit standpoint, the input crosstalk mechanism looks
like a capacitor coupling to a resistive load. For low frequencies,
the magnitude of the crosstalk is given by
(
)( )
sC
RXT
MS
×
=
10
log20
(2)
where:
R
S
is the source resistance.
C
M
is the mutual capacitance between the test signal circuit and
the selected circuit.
s is the Laplace transform variable.
Equation 2 shows that this crosstalk mechanism has a high-pass
nature; it can also be minimized by reducing the coupling
capacitance of the input circuits and lowering the output
impedance of the drivers. If the input is driven from a 75 Ω
terminated cable, the input crosstalk can be reduced by
buffering this signal with a low output impedance buffer.
On the output side, the crosstalk can be reduced by driving a
lighter load. Although the AD8106/AD8107 are specified with
excellent differential gain and phase when driving a standard
150 Ω video load, the crosstalk is higher than the minimum
obtainable because of the high output currents. These currents
induce crosstalk via the mutual inductance of the output pins
and bond wires of the AD8106/AD8107.
AD8106/AD8107 Data Sheet
Rev. A | Page 20 of 22
From a circuit standpoint, this output crosstalk mechanism
looks like a transformer with a mutual inductance between the
windings that drive a load resistor. For low frequencies, the
magnitude of the crosstalk is given by
(
)
L
R
sMxy
XT /
log
20
10
×=
(3)
where:
Mxy is the mutual inductance of output x to output y.
R
L
is the load resistance on the measured output.
This crosstalk mechanism can be minimized by keeping the
mutual inductance low and increasing R
L
. The mutual inductance
can be kept low by increasing the spacing of the conductors and
minimizing their parallel length.
PCB LAYOUT
Extreme care must be exercised to minimize additional
crosstalk generated by the system circuit board(s). The areas
that must be carefully detailed are grounding, shielding, signal
routing, and supply bypassing.
The packaging of the AD8106/AD8107 is designed to help keep
the crosstalk to a minimum. Each input is separated from other
inputs by an analog ground pin. All of these AGNDs should be
connected directly to the ground plane of the circuit board.
These ground pins provide shielding, low impedance return
paths, and physical separation for the inputs. All of these help to
reduce crosstalk.
Each output is separated from its two neighboring outputs by an
analog ground pin and an analog supply pin of one polarity or
the other. Each of these analog supply pins provides power to
the output stages for only the two nearest outputs. These supply
pins and analog grounds provide shielding, physical separation,
and a low impedance supply for the outputs. Individual
bypassing of these supply pins with a 0.01 µF chip capacitor
directly to the ground plane minimizes high frequency output
crosstalk via the mechanism of sharing common impedances.
Each output also has an on-chip compensation capacitor that is
individually tied to the nearby analog ground pins AGND00
through AGND03. This technique reduces crosstalk by preventing
the currents that flow in these paths from sharing a common
impedance on the IC and in the package pins. These AGNDxx
signals should all be connected directly to the ground plane.
The input and output signals have minimum crosstalk if they
are located between ground planes on layers above and below,
and separated by ground in between. Vias should be located as
close to the IC as possible to carry the inputs and outputs to the
inner layer. The only place the input and output signals surface
is at the input termination resistors and the output series back
termination resistors. These signals should also be separated, to
the largest extent possible, as soon as they emerge from the IC
package.
Data Sheet AD8106/AD8107
Rev. A | Page 21 of 22
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC S
T
ANDARDS MS-026-BDD
051706-A
0.15
0.05
1.45
1.40
1.35
0.20
0.09
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
3.5°
TOP VIEW
(PINS DOWN)
1
21
41
40
60
61
80
20
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
1.60
MAX
0.75
0.60
0.45
VIEW
A
PIN 1
14.20
14.00 SQ
13.80
12.20
12.00 SQ
1
1.80
Figure 48. 80-Lead Low Profile Quad Flat Package [LQFP]
(ST-80-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8106ASTZ −40°C to +85°C 80-Lead Low Profile Quad Flat Package [LQFP] ST-80-1
AD8107ASTZ −40°C to +85°C 80-Lead Low Profile Quad Flat Package [LQFP] ST-80-1
1
Z = RoHS Compliant Part.

AD8107ASTZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog & Digital Crosspoint ICs 260 MHz 16 x 5 Buffered
Lifecycle:
New from this manufacturer.
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