Vishay Siliconix
SiS322DNT
New Product
Document Number: 63569
S12-2185-Rev. A, 10-Sep-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET
®
Gen IV Power MOSFET
•100 % R
g
and UIS Tested
• Thin 0.75 mm height
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Switch Mode Power Supplies
• Personal Computers and Servers
• Telecom Bricks
• VRM’s and POL
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257
). The Thin PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T
C
= 25 °C.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
() (Max.) I
D
(A)
f
Q
g
(Typ.)
30
0.0075 at V
GS
= 10 V 38.3
6.9 nC
0.0120 at V
GS
= 4.5 V 30.2
Ordering Information:
SiS322DNT-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
3.30 mm
3.30 mm
Thin PowerPAK
®
1212-8
Bottom View
0.75 mm
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
+ 20, - 16
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
38.3
A
T
C
= 70 °C
30.6
T
A
= 25 °C
15.3
a, b
T
A
= 70 °C
12.1
a, b
Pulsed Drain Current (t = 300 µs)
I
DM
70
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
18
T
A
= 25 °C
2.9
a, b
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
10
Single Pulse Avalanche Energy
E
AS
5
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
19.8
W
T
C
= 70 °C
12.7
T
A
= 25 °C
3.2
a, b
T
A
= 70 °C
3
a, b
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
c, d
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, e
t 10 s R
thJA
31 39
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
56.3