REV. D
–12–
C00831–0–3/02(D)
PRINTED IN U.S.A.
AD745
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead SOIC (R) Package
SEATING
PLANE
0.0118 (0.30)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.1043 (2.65)
0.0926 (2.35)
0.050 (1.27)
BSC
16
9
8
1
0.4193 (10.65)
0.3937 (10.00)
0.2992 (7.60)
0.2914 (7.40)
PIN 1
0.4133 (10.50)
0.3977 (10.00)
0.0125 (0.32)
0.0091 (0.23)
8
0
0.0291 (0.74)
0.0098 (0.25)
45
0.0500 (1.27)
0.0157 (0.40)
Figure 40. Optional External Components for Balancing Source Impedances
AD745
R
S
C
S
C
F
R
1
OUTPUT
C
B
R
B
INVERTING
CONNECTION
C
B
= C
F
|| C
S
R
B
= R
1
|| R
S
AD745
R
2
C
B
R
1
OUTPUT
C
S
R
S
NONINVERTING
CONNECTION
R
B
C
B
= C
S
R
B
= R
S
FOR
R
S
>> R
1
OR R
2
Revision History
Location Page
Data Sheet changed from REV. C to REV. D.
Deleted 8-Lead Plastic Mini-DIP (N) and 8-Lead Cerdip (Q) Packages from CONNECTION DIAGRAM . . . . . . . . . . . . . . . . . . 1
Edits to PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Edits to ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Deleted to METALIZATION PHOTOGRAPH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Deleted text from HOW CHIP PACKAGE TYPE AND POWER DISSIPATION AFFECT INPUT BIAS CURRENT . . . . . . . . 9
Deleted 8-Lead Plastic Mini-DIP (N) and 8-Lead Cerdip (Q) Packages from OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . 12
