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LMV824DR2G

P1-P3P4-P6P7-P9P10-P12P13-P13
LMV821, LMV824
www.onsemi.com
10
APPLICATIONS INFORMATION
+
−
R1
R2
V
O
V
ref
V
in
V
OH
V
O
V
OL
Hysteresis
V
inL
V
inH
V
ref
MC1403
LMV821
−
+
R1
V
CC
V
CC
V
O
2.5 V
R2
50 k
10 k
V
ref
5.0 k
R
C
R
C
+
−
V
O
For: f
o
= 1.0 kHz
R = 16 kW
C = 0.01 mF
V
CC
LMV821
LMV821
Figure 14. Voltage Reference Figure 15. Wien Bridge Oscillator
Figure 16. Comparator with Hysteresis
V
O
+ 2.5 V(1 )
R1
R2
)
V
ref
+
1
2
V
CC
f
O
+
1
2pRC
V
in
L +
R1
R1 ) R2
(V
OL
* V
ref)
) V
ref
V
in
H +
R1
R1 ) R2
(V
OH
* V
ref)
) V
ref
H +
R1
R1 ) R2
(V
OH
* V
OL
)
For less than 10% error from operational amplifier,
((Q
O
f
O
)/BW) < 0.1 where f
o
and BW are expressed in Hz.
If source impedance varies, filter may be preceded with
voltage follower buffer to stabilize filter parameters.
Given: f
o
= center frequency
A(f
o
) = gain at center frequency
Choose value f
o
, C
V
in
Figure 17. Multiple Feedback Bandpass Filter
−
+
V
CC
R3
R1
R2
V
ref
C
C
V
O
CO = 10 C
C
O
LMV821
Then : R3 +
Q
pf
O
C
R1 +
R3
2A(f
O
)
R2 +
R1 R3
4Q
2
R1 * R3
LMV821, LMV824
www.onsemi.com
11
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD 419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B 1.15 1.350.045 0.053
C 0.80 1.100.031 0.043
D 0.10 0.300.004 0.012
G 0.65 BSC0.026 BSC
H --- 0.10---0.004
J 0.10 0.250.004 0.010
K 0.10 0.300.004 0.012
N 0.20 REF0.008 REF
S 2.00 2.200.079 0.087
B0.2 (0.008)
MM
12 3
45
A
G
S
D
5 PL
H
C
N
J
K
−B−
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
ǒ
mm
inches
Ǔ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT
LMV821, LMV824
www.onsemi.com
12
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14
8
71
M
0.25 B
M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B
S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
A 1.35 1.75 0.054 0.068
b 0.35 0.49 0.014 0.019
L 0.40 1.25 0.016 0.049
e 1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M 0 7 0 7
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P12P13-P13

LMV824DR2G

Mfr. #:
Buy LMV824DR2G
Manufacturer:
ON Semiconductor
Description:
Operational Amplifiers - Op Amps LV R2R OPAMP
Lifecycle:
New from this manufacturer.
Delivery:
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